SCHEMBL30107586

SCHEMBL30107586

CCCCCCCCCc1ccccc1P

nearest known ligand 0.58

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LIPG Q9Y5X9 1/20 0.58
NR1H2 P55055 1/20 0.47
NR1H3 Q13133 1/20 0.47
CYSLTR2 Q9NS75 5/20 0.46
CYSLTR1 Q9Y271 5/20 0.46
BID P55957 3/20 0.45
MCL1 Q07820 3/20 0.45
BCL2L1 Q07817 2/20 0.45
BAK1 Q16611 2/20 0.45
KAT8 Q9H7Z6 2/20 0.45
PPARG P37231 1/20 0.45
PPARA Q07869 1/20 0.45
EP300 Q09472 1/20 0.45
KAT2A Q92830 1/20 0.45
KAT2B Q92831 1/20 0.45
KAT5 Q92993 1/20 0.45
SAE1 Q9UBE0 1/20 0.45
THRA P10827 1/20 0.44
THRB P10828 1/20 0.44
HTR2A P28223 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18660547 1.00 LIPG (0.58) LIPGNR1H2NR1H3CYSLTR2CYSLTR1
SCHEMBL30535869 1.00 LIPG (0.58) LIPGNR1H2NR1H3CYSLTR2CYSLTR1
SCHEMBL8519828 1.00 LIPG (0.58) LIPGNR1H2NR1H3CYSLTR2CYSLTR1
SCHEMBL11004527 1.00 LIPG (0.58) LIPGNR1H2NR1H3CYSLTR2CYSLTR1
SCHEMBL11269006 1.00 LIPG (0.58) LIPGNR1H2NR1H3CYSLTR2CYSLTR1
SCHEMBL338793 1.00 LIPG (0.58) LIPGNR1H2NR1H3CYSLTR2CYSLTR1
Water SCHEMBL10945390 0.98 LIPG (0.56) LIPGNR1H2NR1H3CYSLTR2CYSLTR1
Bromide SCHEMBL7758446 0.98 LIPG (0.56) LIPGNR1H2NR1H3CYSLTR2CYSLTR1
Bromide SCHEMBL8061626 0.98 LIPG (0.56) LIPGNR1H2NR1H3CYSLTR2CYSLTR1
Bromide SCHEMBL7757619 0.98 LIPG (0.56) LIPGNR1H2NR1H3CYSLTR2CYSLTR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023140256-A1 MODIFIED EPOXY RESIN, CURABLE RESIN COMPOSITION, AND CURED PRODUCT THEREOF 三菱ケミカル株式会社 2023-07-27 WO disclosed
WO-2022201985-A1 MODIFIED EPOXY RESIN, MANUFACTURING METHOD THEREFOR, CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, COATING MATERIAL, AND ADHESIVE AGENT 三菱ケミカル株式会社 2022-09-29 WO disclosed