Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LIPG | Q9Y5X9 | 1/20 | 0.58 |
| ▸ | NR1H2 | P55055 | 1/20 | 0.47 |
| ▸ | NR1H3 | Q13133 | 1/20 | 0.47 |
| ▸ | CYSLTR2 | Q9NS75 | 5/20 | 0.46 |
| ▸ | CYSLTR1 | Q9Y271 | 5/20 | 0.46 |
| ▸ | BID | P55957 | 3/20 | 0.45 |
| ▸ | MCL1 | Q07820 | 3/20 | 0.45 |
| ▸ | BCL2L1 | Q07817 | 2/20 | 0.45 |
| ▸ | BAK1 | Q16611 | 2/20 | 0.45 |
| ▸ | KAT8 | Q9H7Z6 | 2/20 | 0.45 |
| ▸ | PPARG | P37231 | 1/20 | 0.45 |
| ▸ | PPARA | Q07869 | 1/20 | 0.45 |
| ▸ | EP300 | Q09472 | 1/20 | 0.45 |
| ▸ | KAT2A | Q92830 | 1/20 | 0.45 |
| ▸ | KAT2B | Q92831 | 1/20 | 0.45 |
| ▸ | KAT5 | Q92993 | 1/20 | 0.45 |
| ▸ | SAE1 | Q9UBE0 | 1/20 | 0.45 |
| ▸ | THRA | P10827 | 1/20 | 0.44 |
| ▸ | THRB | P10828 | 1/20 | 0.44 |
| ▸ | HTR2A | P28223 | 1/20 | 0.44 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL18660547 | 1.00 | LIPG (0.58) | LIPGNR1H2NR1H3CYSLTR2CYSLTR1 | |
| SCHEMBL30535869 | 1.00 | LIPG (0.58) | LIPGNR1H2NR1H3CYSLTR2CYSLTR1 | |
| SCHEMBL8519828 | 1.00 | LIPG (0.58) | LIPGNR1H2NR1H3CYSLTR2CYSLTR1 | |
| SCHEMBL30107586 | 1.00 | LIPG (0.58) | LIPGNR1H2NR1H3CYSLTR2CYSLTR1 | |
| SCHEMBL11004527 | 1.00 | LIPG (0.58) | LIPGNR1H2NR1H3CYSLTR2CYSLTR1 | |
| SCHEMBL11269006 | 1.00 | LIPG (0.58) | LIPGNR1H2NR1H3CYSLTR2CYSLTR1 | |
| Water SCHEMBL10945390 | 0.98 | LIPG (0.56) | LIPGNR1H2NR1H3CYSLTR2CYSLTR1 | |
| Bromide SCHEMBL7758446 | 0.98 | LIPG (0.56) | LIPGNR1H2NR1H3CYSLTR2CYSLTR1 | |
| Bromide SCHEMBL8061626 | 0.98 | LIPG (0.56) | LIPGNR1H2NR1H3CYSLTR2CYSLTR1 | |
| Bromide SCHEMBL7757619 | 0.98 | LIPG (0.56) | LIPGNR1H2NR1H3CYSLTR2CYSLTR1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 476 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-109467880-B | Method for improving reliability of semiconductor device packaged by epoxy resin composition | 江苏科化新材料科技有限公司 | 2024-01-12 | — | — | CN | claimed |
| CN-112500652-B | Anti-aging corrosion-resistant outdoor optical cable and preparation method thereof | 国网安徽省电力有限公司阜阳市城郊供电公司 | 2023-11-28 | — | — | CN | claimed |
| CN-116874474-A | Bio-based degradable epoxy resin precursor, marine antifouling paint and preparation method thereof | 中国科学院宁波材料技术与工程研究所 | 2023-10-13 | — | — | CN | claimed |
| CN-111899954-B | Thermosetting epoxy resin composition for packaging inductor and preparation method thereof | 江苏中科科化新材料股份有限公司 | 2023-03-24 | — | — | CN | claimed |
| CN-107955335-B | Preparation method of epoxy resin composition prepared by using stirrer | 江苏科化新材料科技有限公司 | 2021-05-28 | — | — | CN | claimed |
| CN-112724603-A | High-reliability epoxy plastic package material for semiconductor packaging | 江苏科化新材料科技有限公司 | 2021-04-30 | — | — | CN | claimed |
| CN-111899954-A | Thermosetting epoxy resin composition for packaging inductor and preparation method thereof | 江苏科化新材料科技有限公司 | 2020-11-06 | — | — | CN | claimed |
| CN-106674911-B | A kind of semiconductor-sealing-purpose high bonding epoxy-plastic packaging material | 科化新材料泰州有限公司 | 2019-06-07 | — | — | CN | claimed |
| CN-109824933-A | A kind of fire-retardant intelligent photovoltaic thickening layer plating zinc-aluminum film and preparation method thereof | 铜陵鸿盛百诚新能源科技有限公司 | 2019-05-31 | — | — | CN | claimed |
| CN-106280256-B | A kind of high heat resistance moulding type epoxy bottom filler and preparation method thereof and purposes | 江苏中鹏新材料股份有限公司 | 2019-05-17 | — | — | CN | claimed |
| CN-102382422-B | Epoxy resin composition with hydrated alumina | BEIJING KEHUA ADVANCED MATERIAL TECHNOLOGY CO LTD | 2013-01-02 | — | — | CN | claimed |
| CN-102167886-B | Epoxy resin composition and a method for preparing the same | WENYING HUANG | 2012-09-26 | — | — | CN | claimed |
| CN-101696317-B | Epoxy resin composite taking spherical silicon powder as filler, preparation method and application thereof | BEIJING ZHONGXIN TAIHE ELECTRONICAL MATERIALS SCIENCE & TECHNOLOGY CO LTD | 2012-08-29 | — | — | CN | claimed |
| CN-102382422-A | Epoxy resin composition with hydrated alumina | BEIJING KEHUA ADVANCED MATERIAL TECHNOLOGY CO LTD | 2012-03-21 | — | — | CN | claimed |
| CN-102372901-A | Hydantoin epoxy resin composite for encapsulating semiconductor devices | BEIJING ZHONGXIN TAIHE ELECTRONIC MATERIAL TECHNOLOGY CO LTD | 2012-03-14 | — | — | CN | claimed |
| CN-102030968-B | Epoxy resin composition for encapsulating semiconductor device and preparation method thereof | BEIJING KEHUA ADVANCED MATERIALS TECHNOLOGY CO LTD | 2012-02-01 | — | — | CN | claimed |
| CN-102211984-A | Epoxy molding compound, epoxy resin and preparation methods thereof | CHINESE ACAD INST CHEMISTRY | 2011-10-12 | — | — | CN | claimed |
| CN-102167886-A | Epoxy resin composition and a method for preparing the same | WENYING HUANG | 2011-08-31 | — | — | CN | claimed |
| CN-102030968-A | Epoxy resin composition for encapsulating semiconductor device and preparation method thereof | BEIJING KEHUA ADVANCED MATERIALS TECHNOLOGY CO LTD | 2011-04-27 | — | — | CN | claimed |
| CN-101696317-A | Epoxy resin composite taking spherical silicon powder as filler, preparation method and application thereof | BEIJING ZHONGXIN TAIHE ELECTRO | 2010-04-21 | — | — | CN | claimed |