Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29709470 | 0.91 | TSHR (0.47) | TSHRALDH1A1 | |
| SCHEMBL6036748 | 0.89 | TSHR (0.49) | TSHRALDH1A1 | |
| SCHEMBL3164427 | 0.89 | TSHR (0.49) | TSHRALDH1A1 | |
| SCHEMBL31155700 | 0.87 | TSHR (0.44) | TSHRALDH1A1 | |
| SCHEMBL29842311 | 0.85 | TSHR (0.42) | TSHRALDH1A1 | |
| SCHEMBL6131210 | 0.85 | TSHR (0.53) | TSHRALDH1A1 | |
| SCHEMBL30130369 | 0.85 | TSHR (0.40) | TSHRALDH1A1 | |
| SCHEMBL30841757 | 0.83 | TSHR (0.41) | TSHRALDH1A1 | |
| SCHEMBL30151480 | 0.81 | TSHR (0.44) | TSHRALDH1A1 | |
| SCHEMBL30512982 | 0.75 | TSHR (0.50) | TSHRALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-113314402-B | Photoresist composition and method for manufacturing semiconductor device | 台湾积体电路制造股份有限公司 | 2025-03-25 | — | — | CN | disclosed |
| CN-112558416-B | Method for manufacturing semiconductor device | 台湾积体电路制造股份有限公司 | 2025-03-18 | — | — | CN | disclosed |
| CN-113311661-B | Photoresist underlayer composition and method for manufacturing semiconductor device | 台湾积体电路制造股份有限公司 | 2024-10-15 | — | — | CN | disclosed |
| CN-111863601-B | Method for manufacturing semiconductor device and photoresist | 台湾积体电路制造股份有限公司 | 2024-08-27 | — | — | CN | disclosed |
| CN-115494698-A | Method for manufacturing semiconductor device and photoresist | 台湾积体电路制造股份有限公司 | 2022-12-20 | — | — | CN | disclosed |