SCHEMBL30173264

SCHEMBL30173264

CCCCN(C)[Si](C)(C)O[Si](C)(C)C

nearest known ligand 0.32

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
DNM1 Q05193 3/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL25285502 0.86
SCHEMBL20130852 0.79
SCHEMBL23093645 0.75
SCHEMBL20130859 0.70
SCHEMBL30746778 0.69 DNM1 (0.36) DNM1
Hexane SCHEMBL28078439 0.68 TSHR (0.47) DNM1
SCHEMBL28609153 0.67 CA12 (0.30)
Heptane SCHEMBL28749900 0.66 TSHR (0.53) DNM1
SCHEMBL1995921 0.65 DNM1 (0.34) DNM1
SCHEMBL18240744 0.65 DNM1 (0.33) DNM1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250154644-A1 HIGH PRESSURE INERT OXIDATION AND IN-SITU ANNEALING PROCESS TO IMPROVE FILM SEAM QUALITY AND WER LAM RES CORP (US) 2025-05-15 US disclosed
WO-2024254272-A1 METHODS TO PROVIDE VOID FREE TRENCH FILL FOR LOGIC AND MEMORY APPLICATIONS LAM RESEARCH CORPORATION (US) 2024-12-12 WO disclosed
EP-4367709-A1 PLASMA ENHANCED ATOMIC LAYER DEPOSITION OF SILICON-CONTAINING FILMS Lam Research Corporation (US) 2024-05-15 EP disclosed
WO-2023283144-A1 PLASMA ENHANCED ATOMIC LAYER DEPOSITION OF SILICON-CONTAINING FILMS LAM RESEARCH CORPORATION (US) 2023-01-12 WO disclosed