SCHEMBL3024282

SCHEMBL3024282

CC(C)(c1ccc(O)cc1)c1ccccc1C(C)(c1ccc(O)cc1)c1ccc(O)cc1

nearest known ligand 0.63

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 11/20 0.63
ESR2 Q92731 11/20 0.63
CYP3A4 P08684 3/20 0.63
ALDH1A1 P00352 3/20 0.63
TSHR P16473 2/20 0.60
AR P10275 1/20 0.60
HPGD P15428 1/20 0.60
SLC6A2 P23975 1/20 0.60
SLC6A4 P31645 1/20 0.60
HTR6 P50406 1/20 0.60
ESRRG P62508 1/20 0.60
SLC6A3 Q01959 1/20 0.60
HSD17B10 Q99714 1/20 0.60
LMNA P02545 1/20 0.48
TYR P14679 1/20 0.48
MEN1 O00255 1/20 0.43
KMT2A Q03164 1/20 0.43
SHBG P04278 1/20 0.41
TDP1 Q9NUW8 1/20 0.40
PDE4A P27815 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL343839 0.94 ESR1 (0.71) ESR1ESR2CYP3A4ALDH1A1TSHR
SCHEMBL2072464 0.86 ESR1 (0.62) ESR1ESR2CYP3A4ALDH1A1TSHR
SCHEMBL8614758 0.86 ESR1 (0.57) ESR1ESR2CYP3A4ALDH1A1TSHR
SCHEMBL9567886 0.83 ESR1 (0.63) ESR1ESR2CYP3A4ALDH1A1TSHR
SCHEMBL29446724 0.83 ESR1 (0.63) ESR1ESR2CYP3A4ALDH1A1TSHR
SCHEMBL177979 0.83 ESR1 (0.63) ESR1ESR2CYP3A4ALDH1A1TSHR
Phenol SCHEMBL7087181 0.83 ESR1 (0.68) ESR1ESR2CYP3A4ALDH1A1TSHR
SCHEMBL6053109 0.82 ESR1 (0.62) ESR1ESR2CYP3A4ALDH1A1TSHR
SCHEMBL461895 0.82 ESR1 (0.56) ESR1ESR2CYP3A4ALDH1A1TSHR
SCHEMBL7916588 0.82 ESR1 (0.61) ESR1ESR2CYP3A4ALDH1A1TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114207038-B Resin composition, method for producing cured product, pattern cured product, interlayer insulating film, covercoat, surface protective film, and electronic component 艾曲迪微系统股份有限公司 2024-03-22 CN disclosed
US-20220291584-A1 Resin Composition, Method for Manufacturing Cured Product, Cured Product, Patterned Cured Product, Interlayer Insulation Film, Cover Coating Layer, Surface Protection Film, and Electronic Component HD MICROSYSTEMS, LTD. (JP) 2022-09-15 US disclosed
CN-114207038-A Resin composition, method for producing cured product, patterned cured product, interlayer insulating film, covercoat, surface protective film, and electronic component 艾曲迪微系统股份有限公司 2022-03-18 CN disclosed
US-20100216070-A1 Photosensitive Polyimides and Methods of Making the Same CENTRAL GLASS CO., LTD. (JP) 2010-08-26 US disclosed
US-5104964-A Blow molding IDEMITSU PETROCHEMICAL CO., LTD. (JP) 1992-04-14 US disclosed