SCHEMBL30304201

SCHEMBL30304201

OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C(O)Cc1ccccc1

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 2/20 0.50
TRPA1 O75762 2/20 0.48
L3MBTL1 Q9Y468 2/20 0.46
LMNA P02545 1/20 0.46
CYP1A2 P05177 1/20 0.42
EPHX1 P07099 1/20 0.41
TSHR P16473 1/20 0.41
ALPI P09923 1/20 0.39
PKM P14618 1/20 0.39
PTGS1 P23219 1/20 0.39
XIAP P98170 1/20 0.39
SLC7A5 Q01650 1/20 0.39
SLC6A2 P23975 2/20 0.39
TAAR1 Q96RJ0 2/20 0.39
MAOA P21397 1/20 0.39
SLC6A4 P31645 1/20 0.39
SLC6A3 Q01959 1/20 0.39
SIGMAR1 Q99720 1/20 0.39
PDE4A P27815 1/20 0.39
CYP2A6 P11509 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27791729 1.00 TDP1 (0.50) TDP1TRPA1L3MBTL1LMNACYP1A2
SCHEMBL537721 0.98 TRPA1 (0.50) TDP1TRPA1L3MBTL1LMNACYP1A2
SCHEMBL29189650 0.98 TRPA1 (0.50) TDP1TRPA1L3MBTL1LMNACYP1A2
SCHEMBL3418072 0.94 TRPA1 (0.50) TDP1TRPA1L3MBTL1LMNACYP1A2
SCHEMBL4888635 0.91 TRPA1 (0.52) TDP1TRPA1CYP1A2EPHX1ALPI
SCHEMBL6823347 0.89 TRPA1 (0.54) TRPA1CYP1A2EPHX1TSHRALPI
SCHEMBL7279245 0.89 TRPA1 (0.54) TRPA1CYP1A2EPHX1TSHRALPI
SCHEMBL122307 0.85 TRPA1 (0.54) TDP1TRPA1CYP1A2EPHX1TSHR
SCHEMBL4163177 0.85 TRPA1 (0.54) TDP1TRPA1CYP1A2EPHX1TSHR
SCHEMBL2904622 0.85 TRPA1 (0.54) TDP1TRPA1CYP1A2EPHX1TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119730985-B Soldering flux and method for producing bonded body 千住金属工业株式会社 2026-02-27 CN disclosed
CN-119730984-A Soldering flux and preparation method of electronic component 千住金属工业株式会社 2025-03-28 CN disclosed
CN-119730985-A Soldering flux and method for producing bonded body 千住金属工业株式会社 2025-03-28 CN disclosed
CN-119585073-A Soldering flux and soldering paste 千住金属工业株式会社 2025-03-07 CN disclosed
CN-119451774-A Soldering flux, solder paste, and method for producing joined body 千住金属工业株式会社 2025-02-14 CN disclosed
CN-115446500-B Soldering flux and soldering paste 千住金属工业株式会社 2024-12-31 CN disclosed
CN-118055828-B Soldering flux and soldering paste 千住金属工业株式会社 2024-11-19 CN disclosed
CN-118832338-A Soldering flux, solder paste, and method for producing joined body 千住金属工业株式会社 2024-10-25 CN disclosed
CN-118804815-A Soldering flux and soldering paste 千住金属工业株式会社 2024-10-18 CN disclosed
CN-115175783-B Soldering flux and soldering paste 千住金属工业株式会社 2024-09-13 CN disclosed
CN-116529021-B Soldering flux and soldering paste 千住金属工业株式会社 2024-03-08 CN disclosed
CN-117620522-A Method for producing soldering flux and bonded body 千住金属工业株式会社 2024-03-01 CN disclosed
CN-117500632-A Soldering flux and soldering paste 千住金属工业株式会社 2024-02-02 CN disclosed
CN-117377552-A Soldering flux and soldering paste 千住金属工业株式会社 2024-01-09 CN disclosed
CN-114378476-B solder paste 千住金属工业株式会社 2023-08-29 CN disclosed
CN-116529021-A Soldering flux and soldering paste 千住金属工业株式会社 2023-08-01 CN disclosed
CN-116419816-A Soldering flux and soldering paste 千住金属工业株式会社 2023-07-11 CN disclosed
CN-114378482-B Soldering flux and soldering paste 千住金属工业株式会社 2023-05-30 CN disclosed
CN-114378475-B Solder paste 千住金属工业株式会社 2023-05-23 CN disclosed
CN-116060821-A Solder joint, method for producing the same, and joined body 千住金属工业株式会社 2023-05-05 CN disclosed