SCHEMBL30388902

SCHEMBL30388902

Cc1ccc(O)c(C)c1C

nearest known ligand 0.57

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TRPA1 O75762 4/20 0.57
ATM Q13315 1/20 0.57
TP53 P04637 1/20 0.43
TDP1 Q9NUW8 1/20 0.43
SCN5A Q14524 1/20 0.41
HTR1D P28221 1/20 0.40
HTR1B P28222 1/20 0.40
TSHR P16473 1/20 0.40
CASP1 P29466 1/20 0.40
PDE10A Q9Y233 1/20 0.40
ESR1 P03372 3/20 0.39
ESR2 Q92731 2/20 0.39
KDM4E B2RXH2 3/20 0.39
MAPK1 P28482 3/20 0.39
MAPT P10636 2/20 0.39
ALDH1A1 P00352 1/20 0.39
CYP1A2 P05177 1/20 0.39
CYP3A4 P08684 1/20 0.39
CYP2D6 P10635 1/20 0.39
G6PD P11413 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL207038 1.00 TRPA1 (0.57) TRPA1ATMTP53TDP1SCN5A
Phosphine SCHEMBL1067227 0.97 TRPA1 (0.55) TRPA1ATMTP53TDP1SCN5A
Ammonia Solution, Strong SCHEMBL1065150 0.97 TRPA1 (0.55) TRPA1ATMTP53TDP1SCN5A
Hydrochloric Acid SCHEMBL6039932 0.94 TRPA1 (0.52) TRPA1ATMTP53TDP1SCN5A
Dimethylamine SCHEMBL675006 0.92 TRPA1 (0.50) TRPA1ATMTP53TDP1SCN5A
Alcohol SCHEMBL28492687 0.89 TRPA1 (0.48) TRPA1ATMTP53TDP1SCN5A
SCHEMBL16852427 0.89 TRPA1 (0.48) TRPA1ATMTP53TDP1SCN5A
Acetic Acid SCHEMBL6557428 0.87 TRPA1 (0.46) TRPA1ATMTP53TDP1SCN5A
SCHEMBL11865245 0.87 TRPA1 (0.46) TRPA1ATMTP53TDP1SCN5A
Formic Acid SCHEMBL9009952 0.87 TRPA1 (0.46) TRPA1ATMTP53TDP1SCN5A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-109313397-B Method for manufacturing laminate, method for manufacturing semiconductor element, and laminate 富士胶片株式会社 2023-04-11 CN disclosed