SCHEMBL3046360

SCHEMBL3046360

COc1cc(S(=O)(=O)Nc2ccccc2)ccc1C

nearest known ligand 0.78

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
CA12 O43570 2/20 0.78
CA9 Q16790 2/20 0.78
HTT P42858 5/20 0.65
LMNA P02545 5/20 0.59
SMN1; SMN2 Q16637 3/20 0.59
ALDH1A1 P00352 3/20 0.58
MEN1 O00255 3/20 0.58
KMT2A Q03164 3/20 0.58
MAPT P10636 2/20 0.58
TSHR P16473 2/20 0.57
CYP1A2 P05177 1/20 0.57
CYP3A4 P08684 1/20 0.57
PKM P14618 1/20 0.57
CYP2C19 P33261 1/20 0.57
CA1 P00915 1/20 0.57
CA2 P00918 1/20 0.57
NPSR1 Q6W5P4 1/20 0.56
MAPK1 P28482 1/20 0.56
FFAR4 Q5NUL3 1/20 0.55

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8752463 0.88 CA12 (1.00) CA12CA9HTTLMNASMN1; SMN2
SCHEMBL10947961 0.84 CA12 (0.76) CA12CA9HTTLMNASMN1; SMN2
SCHEMBL6792745 0.82 CA12 (0.74) CA12CA9HTTLMNASMN1; SMN2
SCHEMBL27756562 0.81 CA12 (0.60) CA12CA9HTTLMNASMN1; SMN2
SCHEMBL6073367 0.81 CA12 (0.72) CA12CA9HTTLMNASMN1; SMN2
SCHEMBL6809700 0.81 CA12 (0.76) CA12CA9HTTLMNASMN1; SMN2
SCHEMBL9045755 0.81 CA12 (0.76) CA12CA9HTTLMNASMN1; SMN2
SCHEMBL22095988 0.81 CA12 (0.76) CA12CA9HTTLMNASMN1; SMN2
SCHEMBL633327 0.79 CA12 (0.83) CA12CA9HTTLMNASMN1; SMN2
SCHEMBL6140763 0.79 CA12 (0.72) CA12CA9HTTLMNASMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8614051-B2 Photosensitive resin composition and circuit formation substrate using the same HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) 2013-12-24 US disclosed
US-20130143011-A1 PHOTOSENSITIVE RESIN COMPOSITION HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) 2013-06-06 US disclosed
US-20120328856-A1 PHOTOSENSITIVE RESIN COMPOSITION AND CIRCUIT FORMATION SUBSTRATE USING THE SAME HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) 2012-12-27 US disclosed
US-8304160-B2 Photosensitive resin composition and circuit formation substrate using the same HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) 2012-11-06 US disclosed
US-20100260983-A1 PHOTOSENSITIVE RESIN COMPOSITION AND CIRCUIT FORMATION SUBSTRATE USING THE SAME HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) 2010-10-14 US disclosed
US-7642018-B2 Photosensitive resin composition, pattern forming method and electronic parts using the photosensitive resin composition HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) 2010-01-05 US disclosed
US-20070218400-A1 PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD AND ELECTRONIC PARTS USING THE PHOTOSENSITIVE RESIN COMPOSITION HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) 2007-09-20 US disclosed