SCHEMBL304869

SCHEMBL304869

CCCCOC(=O)C(CC)CCCC.[SnH4]

nearest known ligand 0.68

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
CA2 P00918 7/20 0.68
CA1 P00915 4/20 0.68
MAPK1 P28482 1/20 0.57
ALDH1A1 P00352 1/20 0.50
ATM Q13315 3/20 0.47
L3MBTL1 Q9Y468 2/20 0.47
GAA P10253 1/20 0.47
XBP1 P17861 1/20 0.47
NPSR1 Q6W5P4 1/20 0.47
TSHR P16473 3/20 0.44
HPGD P15428 1/20 0.44
TDP1 Q9NUW8 2/20 0.42
CYP3A4 P08684 1/20 0.42
HCAR2 Q8TDS4 1/20 0.41
NAAA Q02083 1/20 0.41
SLC1A3 P43003 1/20 0.40
SLC1A2 P43004 1/20 0.40
SLC1A1 P43005 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL120636 1.00 CA2 (0.68) CA2CA1MAPK1ALDH1A1ATM
SCHEMBL1477902 1.00 CA2 (0.68) CA2CA1MAPK1ALDH1A1ATM
SCHEMBL11099379 0.98 CA2 (0.66) CA2CA1MAPK1ALDH1A1ATM
SCHEMBL30558902 0.98 CA2 (0.66) CA2CA1MAPK1ALDH1A1ATM
SCHEMBL28078701 0.98 CA2 (0.66) CA2CA1MAPK1ALDH1A1ATM
SCHEMBL27658614 0.98 CA2 (0.66) CA2CA1MAPK1ALDH1A1ATM
SCHEMBL1942106 0.96 CA2 (0.68) CA2CA1MAPK1ALDH1A1ATM
SCHEMBL29528988 0.96 CA2 (0.68) CA2CA1MAPK1ALDH1A1ATM
SCHEMBL4409958 0.94 CA2 (0.66) CA2CA1MAPK1TSHRNAAA
SCHEMBL9736174 0.94 CA2 (0.66) CA2CA1MAPK1TSHRNAAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2021020575-A1 TIRE, SURFACE MODIFIER THEREFOR, AND SURFACE MODIFICATION METHOD ダイキン工業株式会社 2021-02-04 WO disclosed
US-20190002694-A1 THERMALLY CONDUCTIVE SILICONE COMPOSITION AND SEMICONDUCTOR DEVICE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2019-01-03 US disclosed
EP-2294138-B1 THERMALLY CONDUCTIVE SILICONE COMPOSITION AND ELECTRONIC DEVICE DOW CORNING TORAY CO LTD (JP) 2018-01-10 EP disclosed
US-8633276-B2 Thermally conductive silicone composition and electronic device DOW CORNING TORAY COMPANY, LTD. (JP) 2014-01-21 US disclosed
US-8138254-B2 Thermally conductive silicone rubber composition DOW CORNING TORAY COMPANY, LTD. (JP) 2012-03-20 US disclosed
US-8093331-B2 Thermally conductive silicone rubber composition DOW CORNING TORAY COMPANY, LTD. (JP) 2012-01-10 US disclosed
US-20110188213-A1 THERMALLY CONDUCTIVE SILICONE COMPOSITION AND ELECTRONIC DEVICE DOW TORAY CO., LTD. (JP) 2011-08-04 US disclosed
EP-2294138-A1 THERMALLY CONDUCTIVE SILICONE COMPOSITION AND ELECTRONIC DEVICE Dow Corning Toray Co., Ltd. (JP) 2011-03-16 EP disclosed
CN-1869125-B Heat conductive silicone composition SHINETSU CHEMICAL CO 2011-01-26 CN disclosed
US-20100234502-A1 ADHESION PROMOTER AND CURABLE RESIN COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2010-09-16 US disclosed
EP-1863878-A1 THERMALLY CONDUCTIVE SILICONE RUBBER COMPOSITION Dow Corning Toray Co., Ltd. (JP) 2007-12-12 EP disclosed
EP-1863877-A1 THERMALLY CONDUCTIVE SILICONE RUBBER COMPOSITION Dow Corning Toray Co., Ltd. (JP) 2007-12-12 EP disclosed
EP-1426413-B1 Hydrophilic polyorganosiloxane composition G C DENTAL IND CORP (JP) 2007-10-24 EP disclosed
CN-1869125-A Heat conductive silicone composition SHINETSU CHEMICAL CO (JP) 2006-11-29 CN disclosed
WO-2006107003-A1 THERMALLY CONDUCTIVE SILICONE RUBBER COMPOSITION DOW CORNING TORAY CO., LTD. (JP) 2006-10-12 WO disclosed
WO-2006107004-A1 THERMALLY CONDUCTIVE SILICONE RUBBER COMPOSITION DOW CORNING TORAY CO., LTD. (JP) 2006-10-12 WO disclosed
US-20040152858-A1 Hydrophilic polyorganosiloxane composition GC CORPORATION (JP) 2004-08-05 US disclosed
EP-1426413-A1 Hydrophilic polyorganosiloxane composition GC Corporation (JP) 2004-06-09 EP disclosed
US-4769412-A POLYSILOXANE, ORGANOSILICON COMPOUND, CATALYST, CARBON BLACK, AND IRON OXIDE SHIN-ETSU CHEMICAL CO., LTD. (JP) 1988-09-06 US disclosed
EP-0215215-A2 Room temperature-curable organopolysiloxane composition containing a photosensitizer Toray Silicone Company, Ltd. (JP) 1987-03-25 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20100234502-A1 ADHESION PROMOTER AND CURABLE RESIN COMPOSITION ELL, CARM1, ITGA1 CA2 3002/4885CA1 992/4885MAPK1 1915/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.