SCHEMBL3049548

SCHEMBL3049548

CCO[W](OCC)(OCC)(OCC)OCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17422902 0.67 KMT2A (0.30)
SCHEMBL3058506 0.67 CA1 (0.30)
Iodide SCHEMBL11469655 0.67
SCHEMBL28982585 0.60 ADRB2 (0.43)
SCHEMBL435498 0.60
Bromide SCHEMBL302866 0.57
Ether SCHEMBL29197006 0.57
Ether SCHEMBL1375446 0.57
Hydrochloric Acid SCHEMBL235391 0.57
Ether SCHEMBL9742788 0.57

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 33 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8476361-B2 Fine pattern transfer material SHOWA DENKO K.K. (JP) 2013-07-02 US claimed
EP-2111566-B1 FINE PATTERN TRANSFER MATERIAL SHOWA DENKO KK (JP) 2010-08-18 EP claimed
US-20100093907-A1 Fine Pattern Transfer Material SHOWDA DENKO K.K. (JP) 2010-04-15 US claimed
EP-2111566-A2 FINE PATTERN TRANSFER MATERIAL Showa Denko K.K. (JP) 2009-10-28 EP claimed
WO-2008099903-A2 FINE PATTERN TRANSFER MATERIAL SHOWA DENKO K.K. (JP) 2008-08-21 WO claimed
US-20260133485-A1 METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE AND UNDERLAYER FILM-FORMING COMPOSITION JSR CORPORATION (JP) 2026-05-14 US disclosed
WO-2025079496-A1 METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE JSR株式会社 2025-04-17 WO disclosed
WO-2025041533-A1 SEMICONDUCTOR SUBSTRATE PRODUCTION METHOD AND FILM-FORMING COMPOSITION JSR株式会社 2025-02-27 WO disclosed
WO-2025013817-A1 METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE, AND UNDERLAYER FILM-FORMING COMPOSITION FOR FIRST METAL-CONTAINING RESIST JSR株式会社 2025-01-16 WO disclosed
US-20240279064-A1 COMPOSITE PARTICLE, NEGATIVE ELECTRODE ACTIVE MATERIAL, AND LITHIUM-ION SECONDARY BATTERY RESONAC CORPORATION (JP) 2024-08-22 US disclosed
EP-4411893-A1 COMPOSITE PARTICLES, NEGATIVE ELECTRODE ACTIVE MATERIAL AND LITHIUM ION SECONDARY BATTERY Resonac Corporation (JP) 2024-08-07 EP disclosed
US-20240002572-A1 SOL LIQUID, MIXED LIQUID, COATING FILM, METHOD OF PRODUCING SOL LIQUID, AND METHOD OF PRODUCING COATING FILM CANON KABUSHIKI KAISHA (JP) 2024-01-04 US disclosed
EP-1375615-A2 Hardcoat compositions and hardcoated articles SHIN-ETSU CHEMICAL CO., LTD. (JP) 2004-01-02 EP disclosed
US-20030236347-A1 Hardcoat compositions and hardcoated articles SHIN-ETSU CHEMICAL CO., LTD. (JP) 2003-12-25 US disclosed
US-20020071077-A1 Anisotropic conductive film, production method thereof, and display apparatus using anisotropic film TDK CORPORATION (JP) 2002-06-13 US disclosed
US-20020010273-A1 Coating composition, coating method, and coated article SHIN-ETSU CHEMICAL CO., LTD. (JP) 2002-01-24 US disclosed
EP-1162247-A2 Coating composition, coating method, and coated article SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-12-12 EP disclosed
US-6126743-A REACTING THREE DIFFERENT METAL OXIDES OR COMPOUNDS OF SPECIFIC DIAMETERS, FIRING OR HEATING THE MIXTURE AT A TEMPERATURE 400-1200 DEGREE C AT WHICH CRYSTAL PHASE CAN BE FORMED SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2000-10-03 US disclosed
US-5389590-A Metal phase dispersed; improved toughness MATSUSHITA ELECTRIC WORKS, LTD. (JP) 1995-02-14 US disclosed
US-5296301-A Polycrystalline ceramic matrix with metal phase dispersed within grains MATSUSHITA ELECTRIC WORKS, LTD. (JP) 1994-03-22 US disclosed