⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL27790284 | 0.82 | — | — | |
| SCHEMBL28122183 | 0.82 | — | — | |
| SCHEMBL29961419 | 0.82 | — | — | |
| SCHEMBL57270 | 0.82 | — | — | |
| SCHEMBL9277286 | 0.82 | — | — | |
| SCHEMBL4229062 | 0.82 | — | — | |
| SCHEMBL57272 | 0.82 | — | — | |
| SCHEMBL9307460 | 0.82 | — | — | |
| SCHEMBL29993447 | 0.82 | — | — | |
| SCHEMBL4229067 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-122061085-A | Preparation method of Al-Cu-Mg-Ag heat-resistant aluminum alloy | 江苏嘉琰嘉森航天新材料有限公司 | 2026-05-19 | — | — | CN | disclosed |
| CN-117551950-B | Al-Cu-Mg-Ag alloy with excellent long-term thermal stability and heat treatment process thereof | 中北大学 | 2024-04-09 | — | — | CN | disclosed |
| CN-117551950-B | Al-Cu-Mg-Ag alloy with excellent long-term thermal stability and heat treatment process thereof | 中北大学 | 2024-04-09 | — | — | CN | disclosed |
| CN-117551950-A | Al-Cu-Mg-Ag alloy with excellent long-term thermal stability and heat treatment process thereof | 中北大学 | 2024-02-13 | — | — | CN | disclosed |
| CN-117551950-A | Al-Cu-Mg-Ag alloy with excellent long-term thermal stability and heat treatment process thereof | 中北大学 | 2024-02-13 | — | — | CN | disclosed |
| CN-116287910-A | Cerium-containing high-strength creep-resistant aluminum-copper-scandium alloy and preparation method thereof | 西安交通大学 | 2023-06-23 | — | — | CN | disclosed |