SCHEMBL3056385

SCHEMBL3056385

C=C(C)C(=O)OC12CCC(C1)C1CCCC12

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7920310 0.84
SCHEMBL4173375 0.82
Methacrylic Acid SCHEMBL27991547 0.82
SCHEMBL18294094 0.78 OPRM1 (0.31)
SCHEMBL7198671 0.78
SCHEMBL18068563 0.75
SCHEMBL18068566 0.75
SCHEMBL7919964 0.75 ALDH1A1 (0.31)
SCHEMBL18068556 0.74
SCHEMBL15299822 0.74 ALDH1A1 (0.34)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 30 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4182379-A1 DIELECTRIC FILM FORMING COMPOSITIONS FUJIFILM Electronic Materials U.S.A, Inc. (US) 2023-05-24 EP claimed
JP-60170619-A None JP disclosed
EP-4182379-A1 DIELECTRIC FILM FORMING COMPOSITIONS FUJIFILM Electronic Materials U.S.A, Inc. (US) 2023-05-24 EP disclosed
US-20180088073-A1 GAS SENSOR AND METHOD OF MANUFACTURE THEREOF ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD. (KR) 2018-03-29 US disclosed
US-20180088073-A1 GAS SENSOR AND METHOD OF MANUFACTURE THEREOF ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD. (KR) 2018-03-29 US disclosed
US-20180031975-A1 PATTERN TREATMENT METHODS ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2018-02-01 US disclosed
US-20180031975-A1 PATTERN TREATMENT METHODS ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2018-02-01 US disclosed
US-9703203-B2 Compositions and methods for pattern treatment DOW GLOBAL TECHNOLOGIES LLC (US) 2017-07-11 US disclosed
US-9703203-B2 Compositions and methods for pattern treatment DOW GLOBAL TECHNOLOGIES LLC (US) 2017-07-11 US disclosed
US-9671697-B2 Pattern treatment methods DOW GLOBAL TECHNOLOGIES LLC (US) 2017-06-06 US disclosed
US-9122163-B2 2015-09-01 US disclosed
US-20140295350-A1 RESIST PATTERN-FORMING METHOD, AND RADIATION-SENSITIVE RESIN COMPOSITION JSR CORP (JP) 2014-10-02 US disclosed
US-8795954-B2 Resist pattern-forming method, and radiation-sensitive resin composition JSR CORPORATION (JP) 2014-08-05 US disclosed
US-20130224661-A1 PATTERN-FORMING METHOD, AND RADIATION-SENSITIVE RESIN COMPOSITION JSR CORPORATION (JP) 2013-08-29 US disclosed
US-20130224666-A1 RESIST PATTERN-FORMING METHOD, AND RADIATION-SENSITIVE RESIN COMPOSITION JSR CORPORATION (JP) 2013-08-29 US disclosed
US-8298743-B2 Positive-type photosensitive composition, transparent conductive film, display element and integrated solar battery FUJIFILM CORPORATION (JP) 2012-10-30 US disclosed
US-20100266956-A1 POSITIVE-TYPE PHOTOSENSITIVE COMPOSITION, TRANSPARENT CONDUCTIVE FILM, DISPLAY ELEMENT AND INTEGRATED SOLAR BATTERY FUJIFILM CORPORATION (JP) 2010-10-21 US disclosed
US-7662448-B2 Photosensitive resin composition for column spacers for liquid crystal display device, column spacers formed using the composition and display device comprising the column spacers CHEIL INDUSTRIES INC. (KR) 2010-02-16 US disclosed
US-20080146694-A1 Photosensitive Resin Composition for Column Spacers for Liquid Crystal Display Device, Column Spacers Formed Using the Composition and Display Device Comprising the Column Spacers CHEIL INDUSTRIES INC. (KR) 2008-06-19 US disclosed
JP-S60170619-A EPOXY RESIN COMPOSITION HITACHI CHEM CO LTD 1985-09-04 JP disclosed