⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL261665 | 0.80 | ALDH1A1 (0.52) | — | |
| SCHEMBL13517871 | 0.78 | — | — | |
| SCHEMBL28411732 | 0.78 | — | — | |
| SCHEMBL29123757 | 0.78 | — | — | |
| SCHEMBL29157685 | 0.76 | — | — | |
| SCHEMBL27639955 | 0.76 | — | — | |
| SCHEMBL29282718 | 0.76 | — | — | |
| SCHEMBL28870733 | 0.76 | — | — | |
| SCHEMBL10340727 | 0.74 | — | — | |
| SCHEMBL30647511 | 0.74 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 99 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3779260-B1 | EXTERNAL PACKAGING MATERIAL FOR VACUUM HEAT INSULATION MATERIAL, VACUUM HEAT INSULATION MATERIAL, AND ARTICLE WITH VACUUM HEAT INSULATION MATERIAL | DAINIPPON PRINTING CO LTD (JP) | 2024-06-26 | — | — | EP | disclosed |
| US-20240002705-A1 | ADHESIVE COMPOSITION | NIPPON SODA CO., LTD. (JP) | 2024-01-04 | — | — | US | disclosed |
| US-11795353-B2 | Adhesive composition | NIPPON SODA CO., LTD. (JP) | 2023-10-24 | — | — | US | disclosed |
| EP-4155361-A1 | ADHESIVE COMPOSITION | Nippon Soda Co., Ltd. (JP) | 2023-03-29 | — | — | EP | disclosed |
| EP-3527642-B1 | ADHESIVE COMPOSITION | NIPPON SODA CO (JP) | 2022-12-21 | — | — | EP | disclosed |
| US-20210284879-A1 | ADHESIVE COMPOSITION | NIPPON SODA CO., LTD. (JP) | 2021-09-16 | — | — | US | disclosed |
| EP-3779260-A1 | EXTERNAL PACKAGING MATERIAL FOR VACUUM HEAT INSULATION MATERIAL, VACUUM HEAT INSULATION MATERIAL, AND ARTICLE WITH VACUUM HEAT INSULATION MATERIAL | Dai Nippon Printing Co., Ltd. (JP) | 2021-02-17 | — | — | EP | disclosed |
| US-20200179977-A1 | SYNTHESIS OF FUNCTIONAL FLUORINATED POLYHEDRAL OLIGOMERIC SILSESQUIOXANE (\"F-POSS\") | GOVERNMENT OF THE UNITED STATES AS REPRESENTED BY THE SECRETARY OF THE AIR FORCE (US) | 2020-06-11 | — | — | US | disclosed |
| US-10550271-B2 | Synthesis of functional fluorinated polyhedral oligomeric silsesquioxane (“F-POSS”) | UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE AIR FORCE (US) | 2020-02-04 | — | — | US | disclosed |
| EP-3527642-A1 | ADHESIVE COMPOSITION | Nippon Soda Co., Ltd. (JP) | 2019-08-21 | — | — | EP | disclosed |
| CN-1210582-C | Method and making contact lenses having UV absorbing properties | BAUSCH & LOMB INCORP (US) | 2005-07-13 | — | — | CN | disclosed |
| CN-1537249-A | Oxygen Permeable Hard Contact Lenses | 可乐丽股份有限公司 | 2004-10-13 | — | — | CN | disclosed |
| CN-1162472-C | Contact lens material | ʿ | 2004-08-18 | — | — | CN | disclosed |
| EP-1386904-A1 | Acenaphthylene derivative, polymer, and antireflection film-forming composition | JSR Corporation (JP) | 2004-02-04 | — | — | EP | disclosed |
| EP-0965618-B1 | Photo-curable composition and photo-cured product | JSR CORP (JP) | 2004-01-02 | — | — | EP | disclosed |
| CN-1373794-A | Contact lens material | BAUSCH & LOMB (US) | 2002-10-09 | — | — | CN | disclosed |
| CN-1301351-A | Method and making contact lenses having UV absorbing properties | BAUSCH & LOMB INCORP (US) | 2001-06-27 | — | — | CN | disclosed |
| CN-1301352-A | Method for making contact lenses having ultraviolet absorbing properties | BAUSCH & LOMB INCORP (US) | 2001-06-27 | — | — | CN | disclosed |
| US-6207728-B1 | COMPOSITION COMPRISING BOTH HYDROLYZABLE SILANE COMPOUND AND HYDROLYZATE THEREOF OR EITHER ONE, PHOTO ACID GENERATOR, DEHYDRATING AGENT | JSR CORPORATION (JP) | 2001-03-27 | — | — | US | disclosed |
| EP-0965618-A1 | Photo-curable composition and photo-cured product | JSR Corporation (JP) | 1999-12-22 | — | — | EP | disclosed |