SCHEMBL306005

SCHEMBL306005

[B].[Co].[Re]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL305668 0.87
SCHEMBL5017415 0.87
SCHEMBL2143588 0.82
SCHEMBL176364 0.82
SCHEMBL136057 0.82
SCHEMBL29354940 0.82
SCHEMBL7793520 0.78
SCHEMBL5015927 0.78
SCHEMBL2207175 0.67
SCHEMBL2229159 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118621174-B Superfine hard alloy and preparation method thereof 崇义章源钨业股份有限公司 2024-11-01 CN claimed
CN-118621174-A High-performance superfine hard alloy and preparation method thereof 崇义章源钨业股份有限公司 2024-09-10 CN claimed
CN-1761534-A Electroless plating solution and method MATTSON TECH INC (US) 2006-04-19 CN claimed
US-20040142114-A1 Electroless plating solution and process MATTSON TECHNOLOGY, INC. 2004-07-22 US claimed
CN-118621174-B Superfine hard alloy and preparation method thereof 崇义章源钨业股份有限公司 2024-11-01 CN disclosed
CN-118621174-B Superfine hard alloy and preparation method thereof 崇义章源钨业股份有限公司 2024-11-01 CN disclosed
CN-118621174-A High-performance superfine hard alloy and preparation method thereof 崇义章源钨业股份有限公司 2024-09-10 CN disclosed
CN-118621174-A High-performance superfine hard alloy and preparation method thereof 崇义章源钨业股份有限公司 2024-09-10 CN disclosed
US-8709906-B2 MIM capacitor and associated production method INFINEON TECHNOLOGIES AG (DE) 2014-04-29 US disclosed
US-20120100689-A1 MIM CAPACITOR AND ASSOCIATED PRODUCTION METHOD INFINEON TECHNOLOGIES AG (DE) 2012-04-26 US disclosed
US-8093637-B2 MIM capacitor and associated production method INFINEON TECHNOLOGIES AG (DE) 2012-01-10 US disclosed
US-20080197497-A1 BARRIER FOR USE IN 3-D INTEGRATION OF CIRCUITS FREESCALE SEMICONDUCTOR, INC. (US) 2008-08-21 US disclosed
US-20070111431-A1 MIM capacitor and associated production method INFINEON TECHNOLOGIES AG (DE) 2007-05-17 US disclosed
CN-1761534-A Electroless plating solution and method MATTSON TECH INC (US) 2006-04-19 CN disclosed
US-6797312-B2 DOES NOT REQUIRE THE USE OF A CATALYST, COMPRISING A FIRST REDUCING AGENT, A SECOND REDUCING AGENT, A PH ADJUSTING AGENT, A FIRST METAL SOURCE, AND A SECOND METAL SOURCE MATTSON TECHNOLOGY, INC. 2004-09-28 US disclosed
WO-2004067192-A1 ELECTROLESS PLATING SOLUTION AND PROCESS MATTSON TECHNOLOGY, INC. (US) 2004-08-12 WO disclosed
US-20040142114-A1 Electroless plating solution and process MATTSON TECHNOLOGY, INC. 2004-07-22 US disclosed
US-6608001-B2 Hydrogenation catalyst; Fischer-Tropsch synthesis CONOCOPHILLIPS COMPANY 2003-08-19 US disclosed
US-20020111262-A1 Catalyst and method of making micrometer sized spherical particles CONOCO INC. 2002-08-15 US disclosed
WO-2002022263-A2 CATALYST AND METHOD OF MAKING MICROMETER SIZED SPHERICAL PARTICLES CONOCO INC. (US) 2002-03-21 WO disclosed