⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5015927 | 0.89 | — | — | |
| SCHEMBL3264089 | 0.87 | — | — | |
| SCHEMBL306947 | 0.87 | — | — | |
| SCHEMBL6688448 | 0.87 | — | — | |
| SCHEMBL306005 | 0.87 | — | — | |
| SCHEMBL306413 | 0.75 | — | — | |
| SCHEMBL5017415 | 0.75 | — | — | |
| SCHEMBL3171641 | 0.75 | — | — | |
| SCHEMBL3266422 | 0.75 | — | — | |
| SCHEMBL5474854 | 0.75 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-100408202-C | Electroless plating solution and process | MATTSON TECH INC (US) | 2008-08-06 | — | — | CN | claimed |
| CN-1761534-A | Electroless plating solution and method | MATTSON TECH INC (US) | 2006-04-19 | — | — | CN | claimed |
| US-6797312-B2 | DOES NOT REQUIRE THE USE OF A CATALYST, COMPRISING A FIRST REDUCING AGENT, A SECOND REDUCING AGENT, A PH ADJUSTING AGENT, A FIRST METAL SOURCE, AND A SECOND METAL SOURCE | MATTSON TECHNOLOGY, INC. | 2004-09-28 | — | — | US | claimed |
| WO-2004067192-A1 | ELECTROLESS PLATING SOLUTION AND PROCESS | MATTSON TECHNOLOGY, INC. (US) | 2004-08-12 | — | — | WO | claimed |
| US-20040142114-A1 | Electroless plating solution and process | MATTSON TECHNOLOGY, INC. | 2004-07-22 | — | — | US | claimed |
| CN-111778531-B | Wear-resistant composite plating solution for increasing excessive steel amount of crystallizer copper pipe | 济南东方结晶器有限公司 | 2022-07-08 | — | — | CN | disclosed |
| CN-111778531-B | Wear-resistant composite plating solution for increasing excessive steel amount of crystallizer copper pipe | 济南东方结晶器有限公司 | 2022-07-08 | — | — | CN | disclosed |
| CN-111778531-A | Wear-resistant composite plating solution for increasing excessive steel amount of crystallizer copper pipe | 济南东方结晶器有限公司 | 2020-10-16 | — | — | CN | disclosed |
| CN-111778531-A | Wear-resistant composite plating solution for increasing excessive steel amount of crystallizer copper pipe | 济南东方结晶器有限公司 | 2020-10-16 | — | — | CN | disclosed |
| US-8709906-B2 | MIM capacitor and associated production method | INFINEON TECHNOLOGIES AG (DE) | 2014-04-29 | — | — | US | disclosed |
| US-20120100689-A1 | MIM CAPACITOR AND ASSOCIATED PRODUCTION METHOD | INFINEON TECHNOLOGIES AG (DE) | 2012-04-26 | — | — | US | disclosed |
| US-8093637-B2 | MIM capacitor and associated production method | INFINEON TECHNOLOGIES AG (DE) | 2012-01-10 | — | — | US | disclosed |
| CN-100408202-C | Electroless plating solution and process | MATTSON TECH INC (US) | 2008-08-06 | — | — | CN | disclosed |
| US-20070111431-A1 | MIM capacitor and associated production method | INFINEON TECHNOLOGIES AG (DE) | 2007-05-17 | — | — | US | disclosed |
| CN-1761534-A | Electroless plating solution and method | MATTSON TECH INC (US) | 2006-04-19 | — | — | CN | disclosed |
| US-6797312-B2 | DOES NOT REQUIRE THE USE OF A CATALYST, COMPRISING A FIRST REDUCING AGENT, A SECOND REDUCING AGENT, A PH ADJUSTING AGENT, A FIRST METAL SOURCE, AND A SECOND METAL SOURCE | MATTSON TECHNOLOGY, INC. | 2004-09-28 | — | — | US | disclosed |
| WO-2004067192-A1 | ELECTROLESS PLATING SOLUTION AND PROCESS | MATTSON TECHNOLOGY, INC. (US) | 2004-08-12 | — | — | WO | disclosed |
| US-20040142114-A1 | Electroless plating solution and process | MATTSON TECHNOLOGY, INC. | 2004-07-22 | — | — | US | disclosed |