SCHEMBL3063751

SCHEMBL3063751

C=CC(=O)OCCCc1cccc(C(=O)O)c1C(=O)O

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
THRB P10828 2/20 0.48
TSHR P16473 4/20 0.44
ALDH1A1 P00352 3/20 0.44
CYP3A4 P08684 1/20 0.44
FOLH1 Q04609 2/20 0.42
KAT8 Q9H7Z6 3/20 0.41
EP300 Q09472 2/20 0.41
KAT2B Q92831 2/20 0.41
KAT5 Q92993 2/20 0.41
HPGD P15428 1/20 0.41
TP53 P04637 2/20 0.40
HIF1A Q16665 2/20 0.40
HSD17B10 Q99714 1/20 0.40
PPARA Q07869 2/20 0.39
BID P55957 4/20 0.39
MCL1 Q07820 4/20 0.39
BCL2L1 Q07817 3/20 0.39
BAK1 Q16611 3/20 0.39
PPARG P37231 1/20 0.39
KAT2A Q92830 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29629278 1.00 THRB (0.48) THRBTSHRALDH1A1CYP3A4FOLH1
SCHEMBL29507099 0.96 THRB (0.47) THRBTSHRALDH1A1CYP3A4FOLH1
SCHEMBL57853 0.92 THRB (0.50) THRBTSHRALDH1A1CYP3A4FOLH1
SCHEMBL29612237 0.92 THRB (0.50) THRBTSHRALDH1A1CYP3A4FOLH1
SCHEMBL30996364 0.87 THRB (0.55) THRBTSHRALDH1A1CYP3A4FOLH1
SCHEMBL11220985 0.87 FOLH1 (0.40) THRBFOLH1KAT8EP300KAT2B
SCHEMBL29150983 0.86 THRB (0.48) THRBTSHRALDH1A1CYP3A4FOLH1
SCHEMBL28531604 0.84 THRB (0.43) THRBALDH1A1CYP3A4FOLH1HPGD
Triethylene Glycol SCHEMBL28273454 0.84 ALDH1A1 (0.45) THRBTSHRALDH1A1CYP3A4FOLH1
SCHEMBL28851562 0.83 THRB (0.47) THRBTSHRALDH1A1CYP3A4FOLH1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118891333-A Pigment dispersion, photosensitive resin composition, cured product, black matrix, image display device, and method for producing pigment dispersion 三菱化学株式会社 2024-11-01 CN disclosed
CN-118175988-A Photocurable composition for nail or artificial nail 三键有限公司 2024-06-11 CN disclosed
CN-118159617-A Release film-attached pressure-sensitive adhesive sheet, laminate for flexible image display device, and pressure-sensitive adhesive sheet 三菱化学株式会社 2024-06-07 CN disclosed
CN-118103412-A Photocurable composition 三键有限公司 2024-05-28 CN disclosed
US-11794381-B2 Laser-debondable composition, laminate thereof, and laser-debonding method DAXIN MATERIALS CORPORATION (TW) 2023-10-24 US disclosed
CN-116829604-A Film material and laminate 松下知识产权经营株式会社 2023-09-29 CN disclosed
CN-116744900-A Photocurable resin composition for nail or artificial nail, cured product thereof, and method for covering nail or artificial nail 三键有限公司 2023-09-12 CN disclosed
CN-116323729-A Method for producing carboxyl group-containing resin and method for controlling molecular weight of carboxyl group-containing resin 三菱化学株式会社 2023-06-23 CN disclosed
CN-116323728-A Method for producing liquid containing carboxyl group-containing resin and method for stabilizing carboxyl group-containing resin 三菱化学株式会社 2023-06-23 CN disclosed
CN-106468857-B Photosensitive resin composition and application thereof 奇美实业股份有限公司 2019-10-15 CN disclosed
EP-1894967-A1 FILLER FOR SUBSTRATE AND COMPOSITION FOR USE AS MATERIAL FOR INORGANIC/ORGANIC COMPOSITE SUBSTRATE FORMATION Nisshinbo Industries, Inc. (JP) 2008-03-05 EP disclosed
US-7258921-B2 Composite particle with a carbodiimide resin layer and a process for producing the same NISSHINBO INDUSTRIES, INC. (JP) 2007-08-21 US disclosed
US-20060052549-A1 Flat particles and process for production thereof NISSHINBO INDUSTRIES, INC. (JP) 2006-03-09 US disclosed
US-20050271875-A1 Composite particle with a carbodimide resin layer and process for producing the same NISSHINBO INDUSTRIES, INC. (JP) 2005-12-08 US disclosed
EP-1553124-A1 FLAKY PARTICLES AND PROCESS FOR PRODUCTION THEREOF Nisshinbo Industries, Inc. (JP) 2005-07-13 EP disclosed
US-20050118424-A1 particles comprising thermoplastic resins impregnated with carbodiimide compounds, having heat and solvent resistance, used as curing agents, stabilizers, hardeners, adhesives, coatings, paints, reinforcements and in automobiles, electronics, furniture, construction materials and as spacers TAKAHASHI IKUO (JP) 2005-06-02 US disclosed
EP-1528077-A1 COMPOSITE PARTICLE HAVING CARBODIIMIDE RESIN LAYER AND PROCESS FOR PRODUCING THE SAME Nisshinbo Industries, Inc. (JP) 2005-05-04 EP disclosed
US-6866934-B2 A thermoplastic resin having a functional group and carbodiimide compound impregnated only in the surface layer section or both surface layer section and inside the base particle and both are strongly bonded by crosslinking reaction NISSHINBO INDUSTRIES, INC. (JP) 2005-03-15 US disclosed
US-20030215636-A1 A thermoplastic resin having a functional group and carbodiimide compound impregnated only in the surface layer section or both surface layer section and inside the base particle and both are strongly bonded by crosslinking reaction NISSHINBO INDUSTRIES, INC. (JP) 2003-11-20 US disclosed
EP-1344795-A2 Carbodiimide-containing hardening type reactive particles, process for producing the same, and use of the same NISSHINBO INDUSTRIES, INC. (JP) 2003-09-17 EP disclosed