SCHEMBL306463

SCHEMBL306463

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nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5014349 0.89
SCHEMBL10939594 0.87
SCHEMBL306493 0.87
SCHEMBL1343559 0.87
SCHEMBL3264089 0.87
SCHEMBL8836580 0.82
SCHEMBL5017446 0.75
SCHEMBL8941777 0.75
SCHEMBL5484757 0.75
SCHEMBL4072519 0.75

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 135 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-105702630-B Semiconductor structure and forming method thereof 中芯国际集成电路制造(上海)有限公司 2020-07-10 CN claimed
US-9406556-B2 Method of making an interconnect device LAM RESEARCH CORPORATION (US) 2016-08-02 US claimed
CN-105702630-A Semiconductor structure and formation method thereof 中芯国际集成电路制造(上海)有限公司 2016-06-22 CN claimed
US-9099327-B2 Multigate structure formed with electroless metal deposition INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2015-08-04 US claimed
US-20150179519-A1 INTERCONNECTION STRUCTURES IN A SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING THE SAME SK Hynix Inc. (KR) 2015-06-25 US claimed
CN-102471918-B Electroless deposition solutions and process control LAM RES CORP 2015-05-27 CN claimed
US-8936978-B2 Multigate structure formed with electroless metal deposition INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2015-01-20 US claimed
US-20140099789-A1 METHOD OF MAKING AN INTERCONNECT DEVICE LAM RESEARCH CORPORATION (US) 2014-04-10 US claimed
US-20130207267-A1 INTERCONNECTION STRUCTURES IN A SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING THE SAME SK Hynix Inc. (KR) 2013-08-15 US claimed
US-8502381-B2 Barrier layer configurations and methods for processing microelectronic topographies having barrier layers LAM RESEARCH CORPORATION (US) 2013-08-06 US claimed
US-7879710-B2 Substrate processing including a masking layer INTERMOLECULAR, INC. (US) 2011-02-01 US claimed
US-20110014361-A1 ELECTROLESS DEPOSITION SOLUTIONS AND PROCESS CONTROL LAM RESEARCH CORPORATION 2011-01-20 US claimed
WO-2011008212-A1 ELECTROLESS DEPOSITION SOLUTIONS AND PROCESS CONTROL LAM RESEARCH CORPORATION (US) 2011-01-20 WO claimed
US-7741228-B2 Method for fabricating semiconductor device PANASONIC CORPORATION (JP) 2010-06-22 US claimed
US-20080299763-A1 METHOD FOR FABRICATING SEMICONDUCTOR DEVICE PANASONIC CORPORATION (JP) 2008-12-04 US claimed
CN-100408202-C Electroless plating solution and process MATTSON TECH INC (US) 2008-08-06 CN claimed
CN-1761534-A Electroless plating solution and method MATTSON TECH INC (US) 2006-04-19 CN claimed
US-6797312-B2 DOES NOT REQUIRE THE USE OF A CATALYST, COMPRISING A FIRST REDUCING AGENT, A SECOND REDUCING AGENT, A PH ADJUSTING AGENT, A FIRST METAL SOURCE, AND A SECOND METAL SOURCE MATTSON TECHNOLOGY, INC. 2004-09-28 US claimed
WO-2004067192-A1 ELECTROLESS PLATING SOLUTION AND PROCESS MATTSON TECHNOLOGY, INC. (US) 2004-08-12 WO claimed
US-20040142114-A1 Electroless plating solution and process MATTSON TECHNOLOGY, INC. 2004-07-22 US claimed