SCHEMBL30689682

SCHEMBL30689682

CCN(NCc1ccccc1)NCc1ccccc1

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP3A4 P08684 2/20 0.48
MAPT P10636 2/20 0.48
KDM4E B2RXH2 1/20 0.48
IDO1 P14902 2/20 0.44
THRB P10828 1/20 0.44
MEN1 O00255 1/20 0.44
KMT2A Q03164 1/20 0.44
TDP1 Q9NUW8 1/20 0.44
L3MBTL1 Q9Y468 1/20 0.44
TP53 P04637 1/20 0.44
TSHR P16473 1/20 0.42
HTT P42858 1/20 0.41
SIGMAR1 Q99720 1/20 0.41
CHRM2 P08172 1/20 0.41
HTR1A P08908 1/20 0.41
ADRA2A P08913 1/20 0.41
CHRM1 P11229 1/20 0.41
DRD1 P21728 1/20 0.41
SLC6A2 P23975 1/20 0.41
SLC6A4 P31645 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10939488 0.94 CYP3A4 (0.43) CYP3A4MAPTKDM4EIDO1THRB
SCHEMBL8854666 0.84 CYP3A4 (0.50) CYP3A4MAPTKDM4EIDO1THRB
SCHEMBL26093384 0.83 CYP3A4 (0.45) CYP3A4MAPTKDM4EIDO1THRB
SCHEMBL24501680 0.78 IDO1 (0.46) CYP3A4MAPTKDM4EIDO1THRB
SCHEMBL10938979 0.78 SIGMAR1 (0.42) CYP3A4MAPTKDM4EIDO1THRB
SCHEMBL29447174 0.78 KCNH2 (0.49) CYP3A4MAPTKDM4ESIGMAR1OPRM1
SCHEMBL17178604 0.77 TSHR (0.47) CYP3A4MAPTKDM4EIDO1THRB
SCHEMBL10937737 0.77 KMT2A (0.41) CYP3A4MAPTKDM4EIDO1THRB
SCHEMBL342670 0.76 CYP3A4 (0.52) CYP3A4MAPTKDM4EIDO1THRB
SCHEMBL10530227 0.75 CYP3A4 (0.42) CYP3A4MAPTKDM4EIDO1THRB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117043221-A Curable composition, cured product, fiber-reinforced composite material, and fiber-reinforced resin molded article DIC株式会社 2023-11-10 CN disclosed