SCHEMBL29447174

SCHEMBL29447174

CCCCCN(NCc1ccccc1)NCc1ccccc1

nearest known ligand 0.50

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
KCNH2 Q12809 5/20 0.49
EPHX2 P34913 3/20 0.46
SIGMAR1 Q99720 2/20 0.44
DRD2 P14416 2/20 0.42
OPRM1 P35372 2/20 0.42
DRD3 P35462 2/20 0.42
OPRD1 P41143 2/20 0.42
OPRK1 P41145 2/20 0.42
KDM4E B2RXH2 1/20 0.41
CYP3A4 P08684 1/20 0.41
MAPT P10636 1/20 0.41
FAAH O00519 1/20 0.40
DNM1 Q05193 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9827950 0.87 KCNH2 (0.50) KCNH2EPHX2SIGMAR1DRD2OPRM1
SCHEMBL26093384 0.86 CYP3A4 (0.45) EPHX2SIGMAR1KDM4ECYP3A4MAPT
SCHEMBL10938224 0.84 SIGMAR1 (0.41) KCNH2EPHX2SIGMAR1KDM4ECYP3A4
SCHEMBL10938979 0.81 SIGMAR1 (0.42) SIGMAR1KDM4ECYP3A4MAPT
SCHEMBL10937737 0.80 KMT2A (0.41) SIGMAR1KDM4ECYP3A4MAPT
SCHEMBL30689682 0.78 CYP3A4 (0.48) KCNH2SIGMAR1OPRM1DRD3KDM4E
SCHEMBL28258094 0.77 KCNH2 (0.43) KCNH2EPHX2SIGMAR1DRD2OPRM1
Dodecane SCHEMBL27793162 0.74 MAOA (0.61) EPHX2SIGMAR1DNM1
SCHEMBL28094151 0.74 KCNH2 (0.42) KCNH2EPHX2SIGMAR1DRD2OPRM1
SCHEMBL11739839 0.74 KCNH2 (0.57) KCNH2EPHX2SIGMAR1DRD2OPRM1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119058235-A Fluid ejection head, method for manufacturing fluid ejection head, fluid ejection assembly, and fluid ejection device 株式会社理光 2024-12-03 CN disclosed
CN-118984828-A Compound, method for producing the compound, curable material, curable composition, method for producing cured product, and cured product 株式会社艾迪科 2024-11-19 CN disclosed
CN-118679204-A Curing agent and adhesive for epoxy resin 盛势达技研株式会社 2024-09-20 CN disclosed
CN-118369320-A Compound, curable resin composition, and cured product 株式会社艾迪科 2024-07-19 CN disclosed
CN-113544183-B Curable resin composition 株式会社艾迪科 2024-07-02 CN disclosed
CN-118076588-A Inclusion compound, epoxy resin curing agent, and curable resin composition 株式会社艾迪科 2024-05-24 CN disclosed
CN-117413002-A Epoxy resin composition 株式会社艾迪科 2024-01-16 CN disclosed
CN-115003726-B Curable resin composition and method for inhibiting curing shrinkage of curable resin composition 株式会社艾迪科 2023-12-05 CN disclosed
CN-116940613-A Curable resin composition, cured product, and adhesive 株式会社艾迪科 2023-10-24 CN disclosed
CN-116848105-A Novel compound and curable resin composition containing same 株式会社艾迪科 2023-10-03 CN disclosed
CN-115003709-B Compound, method for producing compound, and curable composition 株式会社艾迪科 2023-09-29 CN disclosed
CN-116783230-A Curable resin composition 株式会社艾迪科 2023-09-19 CN disclosed
CN-116710436-A Charge transfer complexes 株式会社艾迪科 2023-09-05 CN disclosed
CN-115003709-A Compound, method for producing compound, and curable composition 株式会社艾迪科 2022-09-02 CN disclosed
CN-114207039-A Curable resin composition 株式会社艾迪科 2022-03-18 CN disclosed