SCHEMBL3071329

SCHEMBL3071329

CCCc1ccccc1Oc1ccccc1N

nearest known ligand 0.53

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.50
CYP1A2 P05177 1/20 0.50
CYP2C9 P11712 1/20 0.50
CYP2C19 P33261 1/20 0.50
SLC6A4 P31645 4/20 0.47
SLC6A2 P23975 3/20 0.47
SLC6A3 Q01959 3/20 0.47
ADRA2B P18089 2/20 0.45
PTGS1 P23219 1/20 0.45
TDP1 Q9NUW8 1/20 0.45
HRH1 P35367 1/20 0.44
KDM4E B2RXH2 1/20 0.44
MAPT P10636 1/20 0.44
CRHBP P24387 1/20 0.44
CRHR2 Q13324 1/20 0.44
TAAR1 Q96RJ0 1/20 0.43
GAA P10253 2/20 0.42
AR P10275 1/20 0.42
RCE1 Q9Y256 1/20 0.41
HTR1A P08908 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Ammonia Solution, Strong SCHEMBL10454328 0.98 CYP1A2 (0.49) ALDH1A1CYP1A2CYP2C9CYP2C19SLC6A4
SCHEMBL2202797 0.88 SLC6A2 (0.54) SLC6A4SLC6A2SLC6A3ADRA2BHRH1
SCHEMBL1660710 0.88 SLC6A4 (0.44) ALDH1A1CYP1A2CYP2C9CYP2C19SLC6A4
SCHEMBL8396387 0.86 KDM4E (0.47) ALDH1A1CYP1A2CYP2C9CYP2C19SLC6A4
SCHEMBL6320317 0.80 KDM4E (0.50) ALDH1A1CYP1A2CYP2C9CYP2C19SLC6A4
SCHEMBL3179227 0.79 HRH1 (0.59) ALDH1A1SLC6A4SLC6A2SLC6A3TDP1
SCHEMBL6327863 0.78 CYP1A2 (0.47) ALDH1A1CYP1A2CYP2C9CYP2C19SLC6A4
SCHEMBL983635 0.78 SLC6A2 (0.47) SLC6A4SLC6A2SLC6A3HRH1MAPT
SCHEMBL29443967 0.78 CYP3A4 (0.43) ALDH1A1CYP1A2CYP2C9CYP2C19SLC6A4
SCHEMBL43944 0.78 CYP3A4 (0.43) ALDH1A1CYP1A2CYP2C9CYP2C19SLC6A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 65 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5858584-A POLYIMIDE FILM HITACHI, LTD. (JP) 1999-01-12 US claimed
US-12564050-B2 Thermal substrates DUPONT ELECTRONICS, INC. 2026-02-24 US disclosed
US-20250237016-A1 REPELLENT DAIKIN INDUSTRIES, LTD. (JP) 2025-07-24 US disclosed
WO-2025127140-A1 COMPOSITION ダイキン工業株式会社 2025-06-19 WO disclosed
WO-2025127137-A1 COMPOSITION ダイキン工業株式会社 2025-06-19 WO disclosed
WO-2025127138-A1 COMPOSITION ダイキン工業株式会社 2025-06-19 WO disclosed
WO-2025094931-A1 PULP COMPOSITION ダイキン工業株式会社 2025-05-08 WO disclosed
WO-2025062833-A1 METHOD FOR MANUFACTURING PULP PRODUCT ダイキン工業株式会社 2025-03-27 WO disclosed
WO-2025004962-A1 REPELLENT ダイキン工業株式会社 2025-01-02 WO disclosed
WO-2024176902-A1 POWER-STORAGE-DEVICE AQUEOUS BINDER SOLUTION, POWER-STORAGE-DEVICE SLURRY, POWER-STORAGE-DEVICE ELECTRODE, POWER-STORAGE-DEVICE SEPARATOR, POWER-STORAGE-DEVICE SEPARATOR/ELECTRODE STACK, AND POWER STORAGE DEVICE 荒川化学工業株式会社 2024-08-29 WO disclosed
EP-1531657-A1 Multi-layer substrates having at least two dissimilar polyimide layers and a conductive layer, useful for electronics-type applications, and compositions relating thereto E. I. du Pont de Nemours and Company (US) 2005-05-18 EP disclosed
US-20050100719-A1 Vaiations in glass transition temperature between layers; electroconductive layer DUPONT ELECTRONICS, INC. 2005-05-12 US disclosed
EP-1193280-B1 POLYIMIDE RESIN COMPOSITION WITH IMPROVED MOISTURE RESISTANCE, ADHESIVE SOLUTION, FILMY BONDING MEMBER, LAYERED ADHESIVE FILM, AND PROCESSES FOR PRODUCING THESE KANEKA CORP (JP) 2004-11-24 EP disclosed
WO-2004086146-A1 TRANSPARENT, HIGHLY HEAT-RESISTANT POLYIMIDE PRECURSOR AND PHOTOSENSITIVE POLYIMIDE COMPOSITION THEREOF LG CHEM LTD (KR) 2004-10-07 WO disclosed
EP-1424352-A1 Low temperature polymide adhesive compositions and methods relating thereto E.I.Du pont de nemours and company (US) 2004-06-02 EP disclosed
US-20040099374-A1 Low temperature polyimide adhesive compositions and methods relating thereto DUPONT ELECTRONICS, INC. 2004-05-27 US disclosed
US-6693162-B2 OBTAINED BY REACTION OF TETRACARBOXYLIC ACID ANHYDRIDE CONTAINING ESTER GROUPS WITH AN AROMATIC AMINE; COATINGS FOR SUPERCONDUCTIVE WIRE KANEKA JAPAN CORPORATION (JP) 2004-02-17 US disclosed
US-20030045669-A1 Polyimide resin and resin composition, adhesive solution, film-state joining component,and adhesive laminate film improved in moisture resistance using it,and production methods therefor KANEKA CORPORATION (JP) 2003-03-06 US disclosed
EP-1193280-A1 POLYIMIDE RESIN, RESIN COMPOSITION WITH IMPROVED MOISTURE RESISTANCE COMPRISING THE SAME, ADHESIVE SOLUTION, FILMY BONDING MEMBER, LAYERED ADHESIVE FILM, AND PROCESSES FOR PRODUCING THESE Kaneka Corporation (JP) 2002-04-03 EP disclosed
EP-0322641-A2 Process for improving the adhesion of electrolessly plated metal layers to polyimide surfaces BAYER AG (DE) 1989-07-05 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20250237016-A1 REPELLENT PRMT5, CHAT, DCXR ALDH1A1 2731/4885CYP1A2 660/4885CYP2C9 932/4885
US-12564050-B2 Thermal substrates TTN, AS3MT, SCO2 ALDH1A1 3290/4885CYP1A2 2527/4885CYP2C9 2718/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.