SCHEMBL30725

SCHEMBL30725

CC(C)(c1ccc(OCC2CO2)cc1)c1ccc(C(C)(c2ccc(OCC3CO3)cc2)c2ccc(OCC3CO3)cc2)cc1

nearest known ligand 0.90

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 5/20 0.90
TSHR P16473 4/20 0.90
KMT2A Q03164 4/20 0.90
TP53 P04637 3/20 0.90
MEN1 O00255 3/20 0.90
HIF1A Q16665 3/20 0.90
MAPT P10636 2/20 0.90
HPGD P15428 2/20 0.90
CYP1A2 P05177 1/20 0.90
PPARG P37231 1/20 0.90
PKM P14618 2/20 0.55
LMNA P02545 1/20 0.55
GAA P10253 1/20 0.55
TDP1 Q9NUW8 1/20 0.54
SMN1; SMN2 Q16637 2/20 0.49
CYP3A4 P08684 1/20 0.49
PSMB1 P20618 1/20 0.44
PSMB5 P28074 1/20 0.44
PSMB2 P49721 1/20 0.44
GLA P06280 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15386739 1.00 ALDH1A1 (0.90) ALDH1A1TSHRKMT2ATP53MEN1
SCHEMBL20869690 1.00 ALDH1A1 (0.90) ALDH1A1TSHRKMT2ATP53MEN1
SCHEMBL15355150 1.00 ALDH1A1 (0.90) ALDH1A1TSHRKMT2ATP53MEN1
SCHEMBL15014708 0.95 ALDH1A1 (0.81) ALDH1A1TSHRKMT2ATP53MEN1
SCHEMBL614315 0.95 ALDH1A1 (0.81) ALDH1A1TSHRKMT2ATP53MEN1
SCHEMBL24385166 0.95 ALDH1A1 (0.81) ALDH1A1TSHRKMT2ATP53MEN1
SCHEMBL12440176 0.95 ALDH1A1 (1.00) ALDH1A1TSHRKMT2ATP53MEN1
SCHEMBL17925477 0.95 ALDH1A1 (1.00) ALDH1A1TSHRKMT2ATP53MEN1
SCHEMBL22121 0.95 ALDH1A1 (1.00) ALDH1A1TSHRKMT2ATP53MEN1
SCHEMBL31392960 0.95 ALDH1A1 (1.00) ALDH1A1TSHRKMT2ATP53MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 654 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9683150-B2 Curable composition, adhesive, method of producing fiber-reinforced composite material, and fiber-reinforced composite material TOKYO OHKA KOGYO CO., LTD. (JP) 2017-06-20 US claimed
US-20040106742-A1 Coating composition AZ ELECTRONIC MATERIALS USA CORP. 2004-06-03 US claimed
EP-0251431-B1 EPOXY RESIN MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1993-07-28 EP claimed
US-4954603-A Epoxy resin MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1990-09-04 US claimed
US-4835240-A Epoxy resin composition MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1989-05-30 US claimed
US-12570858-B2 Curable composition, cured product, cured film, display panel, and method for producing cured film TOKYO OHKA KOGYO CO., LTD. (JP) 2026-03-10 US disclosed
US-20250250378-A1 CYANONORBORNENE POLYMERS FOR OIL RESISTANT PHOTOIMAGEABLE COMPOSITIONS PROMERUS, LLC (US) 2025-08-07 US disclosed
CN-120044752-A Photosensitive resin composition 东京应化工业株式会社 2025-05-27 CN disclosed
CN-120044751-A Photosensitive resin composition 东京应化工业株式会社 2025-05-27 CN disclosed
CN-114384758-B Black photosensitive resin composition, method for producing patterned cured product, and black matrix 东京应化工业株式会社 2025-05-13 CN disclosed
US-20250138422-A1 PHOTOSENSITIVE RESIN COMPOSITION, MANUFACTURING METHOD OF ELECTRONIC DEVICE, AND ELECTRONIC DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2025-05-01 US disclosed
US-20250121537-A1 RESIN COMPOSITION FOR INJECTION MOLDING AND METHOD FOR INJECTION-MOLDING THIS COMPOSITION SUMITOMO BAKELITE CO., LTD. (JP) 2025-04-17 US disclosed
EP-1138731-A1 COATING COMPOSITION Clariant International Ltd. (CH) 2001-10-04 EP disclosed
US-5948923-A Phenolepoxy resins prepared from an aqueous-phase-free process INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 1999-09-07 US disclosed
EP-0251431-B1 EPOXY RESIN MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1993-07-28 EP disclosed
US-5004764-A Curable resin containing filler MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1991-04-02 US disclosed
US-4954603-A Epoxy resin MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1990-09-04 US disclosed
EP-0328411-A2 Composition for vibration damper, process for manufacture thereof, and vibration damper MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1989-08-16 EP disclosed
US-4835240-A Epoxy resin composition MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1989-05-30 US disclosed
EP-0251431-A2 Epoxy resin MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1988-01-07 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12570858-B2 Curable composition, cured product, cured film, display panel, and method for producing cured film C5, CFL1, C9 ALDH1A1 1968/4885TSHR 967/4885KMT2A 3480/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.