SCHEMBL307489

SCHEMBL307489

CCCCCCCCCCCCCC[P+](CC)(CC)CC.F[B-](F)(F)F

nearest known ligand 0.59

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
DNM1 Q05193 5/20 0.59
TSHR P16473 1/20 0.40
THRB P10828 1/20 0.40
BDKRB2 P30411 3/20 0.36
LMNA P02545 1/20 0.36
MAPT P10636 1/20 0.35
OPRM1 P35372 1/20 0.33
GGPS1 O95749 2/20 0.32
GPR84 Q9NQS5 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3627501 1.00 DNM1 (0.59) DNM1TSHRTHRBBDKRB2LMNA
SCHEMBL18604248 1.00 DNM1 (0.59) DNM1TSHRTHRBBDKRB2LMNA
SCHEMBL3627860 1.00 DNM1 (0.59) DNM1TSHRTHRBBDKRB2LMNA
SCHEMBL3629835 1.00 DNM1 (0.59) DNM1TSHRTHRBBDKRB2LMNA
SCHEMBL3327816 0.97 DNM1 (0.55) DNM1TSHRTHRBBDKRB2LMNA
SCHEMBL3776132 0.95 DNM1 (0.59) DNM1TSHRTHRBBDKRB2LMNA
SCHEMBL3627704 0.95 DNM1 (0.59) DNM1TSHRTHRBBDKRB2LMNA
SCHEMBL3326492 0.92 DNM1 (0.55) DNM1TSHRTHRBBDKRB2LMNA
SCHEMBL3326737 0.90 DNM1 (0.50) DNM1TSHRBDKRB2LMNA
SCHEMBL4532139 0.90 DNM1 (0.74) DNM1TSHRTHRBBDKRB2LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230030598-A1 EPOXY RESIN COMPOSITION, MOLDING MATERIAL FOR FIBER-REINFORCED COMPOSITE MATERIAL, AND FIBER-REINFORCED COMPOSITE MATERIAL TORAY INDUSTRIES, INC. (JP) 2023-02-02 US disclosed
EP-4071214-A1 EPOXY RESIN COMPOSITION, MOLDING MATERIAL FOR FIBER-REINFORCED COMPOSITE MATERIAL, AND FIBER-REINFORCED COMPOSITE MATERIAL Toray Industries, Inc. (JP) 2022-10-12 EP disclosed
EP-3061793-B1 ELECTRICALLY CONDUCTIVE COMPOSITION, ELECTRICAL CONDUCTOR, ELECTRICAL CONDUCTOR FORMATION METHOD, AND PRODUCTION METHOD FOR POLYMER MITSUBISHI CHEM CORP (JP) 2020-04-15 EP disclosed
EP-3061793-A1 ELECTRICALLY CONDUCTIVE COMPOSITION, ELECTRICAL CONDUCTOR, ELECTRICAL CONDUCTOR FORMATION METHOD, AND PRODUCTION METHOD FOR POLYMER Mitsubishi Rayon Co., Ltd. (JP) 2016-08-31 EP disclosed
US-20160223910-A1 CONDUCTIVE COMPOSITION, CONDUCTOR, METHOD FOR FORMING CONDUCTOR, AND METHOD FOR PRODUCING POLYMER MITSUBISHI RAYON CO., LTD. (JP) 2016-08-04 US disclosed
US-8093317-B2 Antistatic thermoplastic resin composition and molded article composed thereof TORAY INDUSTRIES, INC. (JP) 2012-01-10 US disclosed
US-20090030122-A1 ANTISTATIC THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE COMPOSED THEREOF TORAY INDUSTRIES, INC. (JP) 2009-01-29 US disclosed
EP-1985661-A1 ANTISTATIC THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE MADE FROM SAME TORAY INDUSTRIES, INC. (JP) 2008-10-29 EP disclosed