Predicted protein targets (top 13)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | DNM1 | Q05193 | 2/20 | 0.50 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.39 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.39 |
| ▸ | TSHR | P16473 | 3/20 | 0.37 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.37 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.37 |
| ▸ | CA2 | P00918 | 6/20 | 0.36 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.36 |
| ▸ | BDKRB2 | P30411 | 1/20 | 0.35 |
| ▸ | CA1 | P00915 | 4/20 | 0.34 |
| ▸ | FDPS | P14324 | 1/20 | 0.32 |
| ▸ | LMNA | P02545 | 1/20 | 0.32 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3621413 | 0.94 | DNM1 (0.50) | DNM1ALDH1A1TDP1TSHRCYP3A4 | |
| SCHEMBL3327816 | 0.92 | DNM1 (0.55) | DNM1ALDH1A1TDP1TSHRCYP3A4 | |
| SCHEMBL18604248 | 0.90 | DNM1 (0.59) | DNM1TSHRBDKRB2LMNA | |
| SCHEMBL3629835 | 0.90 | DNM1 (0.59) | DNM1TSHRBDKRB2LMNA | |
| SCHEMBL3627860 | 0.90 | DNM1 (0.59) | DNM1TSHRBDKRB2LMNA | |
| SCHEMBL307489 | 0.90 | DNM1 (0.59) | DNM1TSHRBDKRB2LMNA | |
| SCHEMBL3627501 | 0.90 | DNM1 (0.59) | DNM1TSHRBDKRB2LMNA | |
| SCHEMBL161505 | 0.88 | DNM1 (0.63) | DNM1ALDH1A1TDP1TSHRCYP3A4 | |
| SCHEMBL30616354 | 0.88 | DNM1 (0.61) | DNM1ALDH1A1TDP1TSHRCYP3A4 | |
| SCHEMBL3326492 | 0.86 | DNM1 (0.55) | DNM1ALDH1A1TDP1TSHRCYP3A4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8716401-B2 | Semiconductor chip laminate and adhesive composition for semiconductor chip lamination | LINTEC CORPORATION (JP) | 2014-05-06 | — | — | US | disclosed |
| US-8247112-B2 | Electrolyte, electrolyte solution for lithium-ion secondary battery comprising the electrolyte, and lithium-ion secondary battery using the electrolyte solution | NIPPON CHEMICAL INDUSTRIAL CO., LTD. (JP) | 2012-08-21 | — | — | US | disclosed |
| US-20100133703-A1 | Semiconductor Chip Laminate and Adhesive Composition for Semiconductor Chip Lamination | LINTEC CORPORATION (JP) | 2010-06-03 | — | — | US | disclosed |
| US-20100003597-A1 | ELECTROLYTE, ELECTROLYTE SOLUTION FOR LITHIUM-ION SECONDARY BATTERY COMPRISING THE ELECTROLYTE, AND LITHIUM-ION SECONDARY BATTERY USING THE ELECTROLYTE SOLUTION | NIPPON CHEMICAL INDUSTRIAL CO., LTD. (JP) | 2010-01-07 | — | — | US | disclosed |
| US-6649728-B2 | Polymerization catalysts or curing agents comprising phosphorus compounds such as tetraethylphosphonium tetrafluoroborate, used improve storage stability coating mixtures | NIPPON CHEMICAL INDUSTRIAL CO., LTD. (JP) | 2003-11-18 | — | — | US | disclosed |
| US-20030109378-A1 | Catalyst for curing epoxy resins, method for making the same, epoxy resin composition, and powder coating composition | NIPPON CHEMICAL INDUSTRIAL CO., LTD. (JP) | 2003-06-12 | — | — | US | disclosed |