SCHEMBL3076717

SCHEMBL3076717

C=C[Si](C)(NC(C)C)NC(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4579168 0.77
SCHEMBL26255365 0.77
SCHEMBL10357930 0.74 ALDH1A1 (0.30)
SCHEMBL231605 0.73 TSHR (0.31)
SCHEMBL233275 0.73 TSHR (0.31)
SCHEMBL25171696 0.73 TSHR (0.31)
SCHEMBL29291006 0.67
SCHEMBL3120020 0.65
SCHEMBL25168590 0.65
SCHEMBL26255505 0.65

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 112 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12584212-B2 Compositions and methods using same for germanium seed layer VERSUM MATERIALS US, LLC (US) 2026-03-24 US claimed
US-12421603-B2 Composition for high temperature atomic layer deposition of high quality silicon oxide thin films VERSUM MATERIALS US, LLC (US) 2025-09-23 US claimed
US-20230287562-A1 COMPOSITIONS ND METHODS USING SAME FOR GERMANIUM SEED LAYER VERSUM MATERIALS US, LLC 2023-09-14 US claimed
US-11649547-B2 Deposition of carbon doped silicon oxide VERSUM MATERIALS US, LLC (US) 2023-05-16 US claimed
EP-4176100-A1 COMPOSITIONS AND METHODS USING SAME FOR GERMANIUM SEED LAYER Versum Materials US, LLC (US) 2023-05-10 EP claimed
US-20210363639-A1 COMPOSITION FOR HIGH TEMPERATURE ATOMIC LAYER DEPOSITION OF HIGH QUALITY SILICON OXIDE THIN FILMS VERSUM MATERIALS US, LLC (US) 2021-11-25 US claimed
EP-3902939-A1 DEPOSITION OF CARBON DOPED SILICON OXIDE Versum Materials US, LLC (US) 2021-11-03 EP claimed
EP-3844319-A1 COMPOSITION FOR HIGH TEMPERATURE ATOMIC LAYER DEPOSITION OF HIGH QUALITY SILICON OXIDE THIN FILMS Versum Materials US, LLC (US) 2021-07-07 EP claimed
WO-2020163359-A1 DEPOSITION OF CARBON DOPED SILICON OXIDE VERSUM MATERIALS US, LLC (US) 2020-08-13 WO claimed
US-20200248309-A1 Deposition Of Carbon Doped Silicon Oxide VERSUM MATERIALS US, LLC (US) 2020-08-06 US claimed
US-20130295779-A1 HIGH TEMPERATURE ATOMIC LAYER DEPOSITION OF SILICON OXIDE THIN FILMS VERSUM MATERIALS US, LLC 2013-11-07 US claimed
EP-2650399-A2 High temperature atomic layer deposition of silicon oxide thin films AIR PRODUCTS AND CHEMICALS, INC. (US) 2013-10-16 EP claimed
US-8460753-B2 Methods for depositing silicon dioxide or silicon oxide films using aminovinylsilanes AIR PRODUCTS AND CHEMICALS, INC. (US) 2013-06-11 US claimed
EP-2192207-B1 Method using amino vinylsilane precursors for the deposition of intrinsically compressively stressed SiN films AIR PROD & CHEM (US) 2012-06-20 EP claimed
US-20120148745-A1 Aminovinylsilane for CVD and ALD SiO2 Films AIR PRODUCTS AND CHEMICALS, INC. (US) 2012-06-14 US claimed
EP-2463404-A1 Aminovinylsilane for cvd and ald sio2 films Air Products and Chemicals, Inc. (US) 2012-06-13 EP claimed
US-20100291321-A1 Dielectric Barrier Deposition Using Nitrogen Containing Precursor AIR PRODUCTS AND CHEMICALS, INC. (US) 2010-11-18 US claimed
EP-2251899-A1 Dielectric barrier deposition using nitrogen containing precursor Air Products and Chemicals, Inc. (US) 2010-11-17 EP claimed
EP-2192207-A1 Amino vinylsilane precursors for the deposition of intrinsically compressively stressed SiN films AIR PRODUCTS AND CHEMICALS, INC. (US) 2010-06-02 EP claimed
US-20100120262-A1 Amino Vinylsilane Precursors for Stressed SiN Films AIR PRODUCTS AND CHEMICALS, INC. (US) 2010-05-13 US claimed