SCHEMBL30782804

SCHEMBL30782804

O=C(O)c1ccncc1-c1ccccc1-c1ccccc1

nearest known ligand 0.49

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4C Q9H3R0 10/20 0.49
KDM4D Q6B0I6 4/20 0.49
KDM6B O15054 4/20 0.49
ALDH1A1 P00352 2/20 0.49
KDM4E B2RXH2 2/20 0.49
KDM4A O75164 2/20 0.49
KMT2A Q03164 2/20 0.49
MEN1 O00255 1/20 0.49
MAPT P10636 1/20 0.49
THRB P10828 1/20 0.49
TDP1 Q9NUW8 1/20 0.49
L3MBTL1 Q9Y468 1/20 0.49
KDM5B Q9UGL1 1/20 0.48
HNF4A P41235 1/20 0.47
SLC22A12 Q96S37 1/20 0.47
RPS6KA3 P51812 1/20 0.46
LTB4R2 Q9NPC1 1/20 0.46
CYP46A1 Q9Y6A2 1/20 0.46
DHODH Q02127 1/20 0.45
TNF P01375 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28883633 1.00 KDM4C (0.49) KDM4CKDM4DKDM6BALDH1A1KDM4E
SCHEMBL2749796 0.91 KDM4C (0.53) KDM4CKDM4DKDM6BALDH1A1KDM4E
SCHEMBL9847043 0.88 KDM4C (0.56) KDM4CKDM4DKDM6BALDH1A1KDM4E
SCHEMBL20593569 0.87 KDM4C (0.53) KDM4CKDM4DKDM6BALDH1A1KDM4E
SCHEMBL29950415 0.81 KDM4C (0.61) KDM4CKDM4DKDM6BALDH1A1KDM4E
SCHEMBL6870086 0.81 MYC (0.53) KDM4CKDM4DKDM6BALDH1A1KDM4E
SCHEMBL2222831 0.80 ALDH1A1 (0.50) KDM4CKDM4DKDM6BALDH1A1KDM4E
SCHEMBL2560322 0.80 KDM4C (0.49) KDM4CKDM4DKDM6BALDH1A1KDM4E
SCHEMBL22717425 0.80 GPBAR1 (0.45) KDM4CKDM4DKDM6BALDH1A1KDM4E
SCHEMBL29574193 0.80 GPBAR1 (0.45) KDM4CKDM4DKDM6BALDH1A1KDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110647010-B Resin composition, dry film, method for producing dry film, resist film, substrate, and method for producing plating molded article 东京应化工业株式会社 2024-02-09 CN disclosed