SCHEMBL30801385

SCHEMBL30801385

CCCCC(CC)CNC(Cn1cnc2ccccc21)C(CC)CCCC

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
APAF1 O14727 1/20 0.41
AGER Q15109 4/20 0.40
GGPS1 O95749 1/20 0.39
FDPS P14324 1/20 0.39
TDP1 Q9NUW8 1/20 0.39
ASAH1 Q13510 1/20 0.38
IDO1 P14902 1/20 0.37
KDM4E B2RXH2 2/20 0.37
NPC1 O15118 1/20 0.37
LMNA P02545 4/20 0.37
MAPT P10636 3/20 0.37
HTT P42858 3/20 0.37
SMN1; SMN2 Q16637 3/20 0.37
TSHR P16473 2/20 0.37
MAPK1 P28482 2/20 0.37
NPSR1 Q6W5P4 1/20 0.37
POLB P06746 1/20 0.37
HSD17B10 Q99714 1/20 0.37
ALDH1A1 P00352 1/20 0.36
GAA P10253 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL22189059 0.82 APAF1 (0.51) APAF1AGERGGPS1FDPSTDP1
SCHEMBL1034854 0.75 APAF1 (0.51) APAF1AGERGGPS1FDPSTDP1
SCHEMBL1992186 0.75 APAF1 (0.51) APAF1AGERGGPS1FDPSTDP1
SCHEMBL9180561 0.75 APAF1 (0.51) APAF1AGERGGPS1FDPSTDP1
SCHEMBL28879025 0.75 APAF1 (0.51) APAF1AGERGGPS1FDPSTDP1
SCHEMBL9636144 0.72 TDP1 (0.44) APAF1AGERGGPS1FDPSTDP1
SCHEMBL8177049 0.68 APAF1 (0.49) APAF1AGERGGPS1FDPSTDP1
SCHEMBL27659956 0.68 AGER (0.56) APAF1AGERGGPS1FDPSTDP1
SCHEMBL13545635 0.67 APAF1 (0.61) APAF1AGERGGPS1FDPSTDP1
SCHEMBL15821807 0.67 ASAH1 (0.41) APAF1TDP1ASAH1KDM4ELMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117687268-B Photosensitive resin composition, photosensitive dry film and copper-clad plate 湖南初源新材料股份有限公司 2024-04-19 CN disclosed
CN-117687268-A Photosensitive resin composition, photosensitive dry film and copper-clad plate 湖南初源新材料股份有限公司 2024-03-12 CN disclosed