Methyl Alcohol

Methyl Alcohol

SCHEMBL3081581

CO.CO.Cc1ccc(O)c(Cc2cc(C)ccc2O)c1

nearest known ligand 0.80

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
AMY1A P0DUB6 1/20 0.80
TRPA1 O75762 2/20 0.54
TP53 P04637 2/20 0.52
TDP1 Q9NUW8 1/20 0.52
ALOX15 P16050 4/20 0.52
LMNA P02545 4/20 0.52
HPGD P15428 3/20 0.52
MAPT P10636 3/20 0.52
HSPA5 P11021 3/20 0.52
HTT P42858 2/20 0.52
MEN1 O00255 2/20 0.52
ALOX12 P18054 2/20 0.52
KMT2A Q03164 2/20 0.52
HIF1A Q16665 2/20 0.52
SMN1; SMN2 Q16637 2/20 0.52
SLC22A1 O15245 1/20 0.52
USP2 O75604 1/20 0.52
HSP90AA1 P07900 1/20 0.52
CYP3A4 P08684 1/20 0.52
HSPD1 P10809 1/20 0.52

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29402131 0.98 AMY1A (0.83) AMY1ATRPA1TP53TDP1ALOX15
SCHEMBL50622 0.98 AMY1A (0.83) AMY1ATRPA1TP53TDP1ALOX15
SCHEMBL29621432 0.98 AMY1A (0.83) AMY1ATRPA1TP53TDP1ALOX15
SCHEMBL3820165 0.89 AMY1A (1.00) AMY1ATRPA1TP53TDP1ALOX15
SCHEMBL22664017 0.89 AMY1A (0.78) AMY1ATRPA1TP53TDP1ALOX15
SCHEMBL1345514 0.89 AMY1A (1.00) AMY1ATRPA1TP53TDP1ALOX15
SCHEMBL29623092 0.89 AMY1A (1.00) AMY1ATRPA1TP53TDP1ALOX15
SCHEMBL18352 0.89 AMY1A (1.00) AMY1ATRPA1TP53TDP1ALOX15
SCHEMBL1345563 0.89 AMY1A (1.00) AMY1ATRPA1TP53TDP1ALOX15
SCHEMBL1345917 0.89 AMY1A (1.00) AMY1ATRPA1TP53TDP1ALOX15

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1806618-B1 POSITIVE PHOTOSENSITIVE INSULATING RESIN COMPOSITION AND CURED PRODUCT THEREOF JSR CORP (JP) 2010-06-09 EP claimed
EP-2228400-B1 NOVEL POLYIMIDE SILICONE, PHOTOSENSITIVE RESIN COMPOSITION CONTAINING THE NOVEL POLYIMIDE SILICONE, AND METHOD FOR PATTERN FORMATION SHINETSU CHEMICAL CO (JP) 2016-04-27 EP disclosed
US-8263308-B2 Polyimide silicone, photosensitive resin composition containing the novel polyimide silicone, and method for pattern formation SHIN-ETSU CHEMICAL CO., LTD. (JP) 2012-09-11 US disclosed
US-20100233619-A1 NOVEL POLYIMIDE SILICONE, PHOTOSENSITIVE RESIN COMPOSITION CONTAINING THE NOVEL POLYIMIDE SILICONE, AND METHOD FOR PATTERN FORMATION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2010-09-16 US disclosed
EP-2228400-A1 Novel polyimide silicone, photosensitive resin composition containing the novel polyimide silicone, and method for pattern formation Shin-Etsu Chemical Co., Ltd. (JP) 2010-09-15 EP disclosed
EP-1806618-B1 POSITIVE PHOTOSENSITIVE INSULATING RESIN COMPOSITION AND CURED PRODUCT THEREOF JSR CORP (JP) 2010-06-09 EP disclosed
US-20080097032-A1 Positive Photosensitive Insulating Resin Composition And Cured Product Thereof JSR CORPORATION (JP) 2008-04-24 US disclosed
EP-1806618-A1 POSITIVE PHOTOSENSITIVE INSULATING RESIN COMPOSITION AND CURED PRODUCT THEREOF JSR Corporation (JP) 2007-07-11 EP disclosed
US-5302688-A Selected block phenolic oligomers and their use in phenolic resin compositions and in radiation-sensitive resist compositions OCG MICROELECTRONIC MATERIALS, INC. (US) 1994-04-12 US disclosed
US-5232819-A Coating a substrate with a mixture of a radiation sensitive O-quinonediazide and a phenolic resin binder, imagewise exposure to radiation and developing to form a positive pattern in the coating OCG MICROELECTRONIC MATERIALS, INC. (US) 1993-08-03 US disclosed
US-5196289-A With o-quinonediazide OCG MICROELECTRONIC MATERIALS, INC. (US) 1993-03-23 US disclosed
WO-1991003448-A1 SELECTED BLOCK PHENOLIC OLIGOMERS AND THEIR USE IN PHENOLIC RESIN COMPOSITIONS AND IN RADIATION-SENSITIVE RESIST COMPOSITIONS OCG MICROELECTRONIC MATERIALS, INC. (US) 1991-03-21 WO disclosed