Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TDP1 | Q9NUW8 | 3/20 | 0.52 |
| ▸ | ALOX15 | P16050 | 2/20 | 0.52 |
| ▸ | TYMS | P04818 | 4/20 | 0.48 |
| ▸ | ALOX5 | P09917 | 1/20 | 0.36 |
| ▸ | HDAC4 | P56524 | 2/20 | 0.35 |
| ▸ | HDAC2 | Q92769 | 2/20 | 0.35 |
| ▸ | HDAC8 | Q9BY41 | 2/20 | 0.35 |
| ▸ | HDAC6 | Q9UBN7 | 1/20 | 0.35 |
| ▸ | ALDH1A1 | P00352 | 5/20 | 0.33 |
| ▸ | TSHR | P16473 | 3/20 | 0.33 |
| ▸ | MAOA | P21397 | 2/20 | 0.33 |
| ▸ | HPGD | P15428 | 3/20 | 0.32 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.32 |
| ▸ | L3MBTL1 | Q9Y468 | 2/20 | 0.32 |
| ▸ | HNF4A | P41235 | 1/20 | 0.32 |
| ▸ | LMNA | P02545 | 1/20 | 0.32 |
| ▸ | MAPT | P10636 | 1/20 | 0.32 |
| ▸ | MAOB | P27338 | 1/20 | 0.32 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.32 |
| ▸ | HTT | P42858 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL31416073 | 1.00 | TDP1 (0.52) | TDP1ALOX15TYMSALOX5HDAC4 | |
| SCHEMBL30499372 | 0.92 | ALOX15 (0.50) | TDP1ALOX15TYMSHDAC4HDAC2 | |
| SCHEMBL29067257 | 0.92 | ALOX15 (0.50) | TDP1ALOX15TYMSHDAC4HDAC2 | |
| SCHEMBL542116 | 0.91 | TDP1 (0.54) | TDP1ALOX15TYMSHDAC4HDAC2 | |
| SCHEMBL6300640 | 0.90 | TSHR (0.43) | TDP1ALOX15TYMSALDH1A1TSHR | |
| SCHEMBL2087097 | 0.87 | TDP1 (0.60) | TDP1ALOX15TYMSALDH1A1TSHR | |
| SCHEMBL31548711 | 0.87 | TDP1 (0.60) | TDP1ALOX15TYMSALDH1A1TSHR | |
| SCHEMBL29350552 | 0.86 | ALOX15 (0.48) | TDP1ALOX15TYMSALOX5HDAC4 | |
| SCHEMBL16508001 | 0.86 | ALOX15 (0.48) | TDP1ALOX15TYMSALOX5HDAC4 | |
| SCHEMBL1689836 | 0.86 | ALOX15 (0.48) | TDP1ALOX15TYMSALOX5HDAC4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20230106839-A1 | LAMINATE, SINGLE-SIDED METAL-CLAD LAMINATED SHEET, AND MULTI-LAYER PRINTED WIRING BOARD | KANEKA CORPORATION (JP) | 2023-04-06 | — | — | US | disclosed |
| CN-115697694-A | Laminate, single-sided metal-clad laminate, and multilayer printed wiring board | 株式会社钟化 | 2023-02-03 | — | — | CN | disclosed |
| US-8313831-B2 | Thermoplastic polyimide resin film, multilayer body and method for manufacturing printed wiring board composed of same | KANEKA CORPORATION (JP) | 2012-11-20 | — | — | US | disclosed |
| US-8092900-B2 | Solution, component for plating, insulating sheet, laminate, and printed circuit board | KANEKA CORPORATION (JP) | 2012-01-10 | — | — | US | disclosed |
| US-7849593-B2 | Method of making multi-layer circuit board | FUJIFILM CORPORATION (JP) | 2010-12-14 | — | — | US | disclosed |
| US-7838114-B2 | flexible printed circuits; dielectric, flowability, heat resistance, adhesiveness, and processability; a polyimide resin, an monomeric aromatic amine, an epoxy resin (polyepoxide), and an imidazole compound; 1,3-bis(3-aminophenoxy)benzene | KANEKA CORPORATION (JP) | 2010-11-23 | — | — | US | disclosed |
| US-20090281267-A1 | Material for planting and use thereof | KANEKA CORPORATION (JP) | 2009-11-12 | — | — | US | disclosed |
| US-20090025966-A1 | Fiber-resin composite, laminate, printed wiring board, and method for manufacturing printed wiring board | KANEKA CORPORATION (JP) | 2009-01-29 | — | — | US | disclosed |
| US-20080314618-A1 | Solution, Component for Plating, Insulating Sheet, Laminate, and Printed Circuit Board | KANEKA CORPORATION (JP) | 2008-12-25 | — | — | US | disclosed |
| US-20080312383-A1 | Thermosetting Resin Composition, And Laminate and Circuit Substrate Using Same | KANEKA CORPORATION (JP) | 2008-12-18 | — | — | US | disclosed |
| US-20060048963-A1 | Laminate, printed circuit board, and preparing method thereof | KANEKA CORPORATION (JP) | 2006-03-09 | — | — | US | disclosed |
| US-20050221080-A1 | polyimide film with a metal layer laminated on one face and an adhesive layer laminated on the other face; printed wiring boards; high heat resistance, wiring patterns with narrow pitches, vias with a small diameter | KANEKA CORPORATION | 2005-10-06 | — | — | US | disclosed |
| US-6911265-B2 | Laminate | KANEKA CORPORATION (JP) | 2005-06-28 | — | — | US | disclosed |
| US-20050119381-A1 | Thermosetting resin composition and laminates and circuit board substrates made by using the same | KANEKA CORPORATION (JP) | 2005-06-02 | — | — | US | disclosed |
| US-20040176526-A1 | Resin composition | KANEKA CORPORAITON (JP) | 2004-09-09 | — | — | US | disclosed |
| US-20030194573-A1 | Multilayer structure and multilayer wiring board using the same | KANEKA CORPORATION (JP) | 2003-10-16 | — | — | US | disclosed |
| US-20030113521-A1 | Laminate | KANEKA CORPORATION (JP) | 2003-06-19 | — | — | US | disclosed |
| EP-0247731-B1 | NOVEL PARA- OR META-TERPHENYLTETRACARBOXYLIC ACID, DIANHYDRIDE THEREOF AND PROCESS FOR PREPARING THE SAME | Hitachi Chemical Co., Ltd. (JP) | 1991-08-21 | — | — | EP | disclosed |
| US-4912233-A | Para- or meta-terphenyltetracarboxylic acid, dianhydride thereof and process for preparing the same | HITACHI CHEMICAL COMPANY, LTD. (JP) | 1990-03-27 | — | — | US | disclosed |
| EP-0247731-A1 | Novel para- or meta-terphenyltetracarboxylic acid, dianhydride thereof and process for preparing the same | Hitachi Chemical Co., Ltd. (JP) | 1987-12-02 | — | — | EP | disclosed |