Phenol

Phenol

SCHEMBL30853590

C=C(C)CC(=O)c1ccccc1.Oc1ccccc1.Oc1ccccc1

nearest known ligand 0.57

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 4/20 0.57
HPGD P15428 3/20 0.57
MAPK1 P28482 3/20 0.57
MEN1 O00255 2/20 0.57
KMT2A Q03164 2/20 0.57
CYP3A4 P08684 2/20 0.57
SMN1; SMN2 Q16637 2/20 0.57
TDP1 Q9NUW8 2/20 0.57
KDM4E B2RXH2 1/20 0.57
ALOX15 P16050 1/20 0.57
CES1 P23141 1/20 0.57
NPC1 O15118 2/20 0.52
RAB9A P51151 2/20 0.52
PTPN1 P18031 2/20 0.50
ERCC5 P28715 1/20 0.50
FEN1 P39748 1/20 0.50
ALDH1A1 P00352 4/20 0.47
HIF1A Q16665 2/20 0.47
PLOD2 O00469 2/20 0.47
PLOD3 O60568 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL487605 0.92 KMT2A (0.67) MAPTHPGDMAPK1MEN1KMT2A
SCHEMBL31190050 0.81 ERCC5 (0.62) MAPTHPGDMAPK1MEN1KMT2A
SCHEMBL7462231 0.80 MEN1 (0.55) MAPTHPGDMAPK1MEN1KMT2A
Dibenzoylmethane SCHEMBL27744145 0.79 KMT2A (0.71) MAPTHPGDMAPK1MEN1KMT2A
SCHEMBL127249 0.78 MEN1 (0.77) MAPTHPGDMAPK1MEN1KMT2A
Dibenzoylmethane SCHEMBL28139772 0.78 KMT2A (0.85) MAPTHPGDMAPK1MEN1KMT2A
SCHEMBL14417637 0.77 ERCC5 (0.64) MAPTHPGDMAPK1MEN1KMT2A
Phenol SCHEMBL28316006 0.76 CES2 (0.50) MAPTMEN1KMT2ACYP3A4SMN1; SMN2
SCHEMBL15116 0.76 KMT2A (0.73) MAPTHPGDMAPK1MEN1KMT2A
SCHEMBL11373627 0.76 KMT2A (0.73) MAPTHPGDMAPK1MEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112898738-B Epoxy resin composition, prepreg, laminate, printed wiring board, and cured product using same 日铁化学材料株式会社 2024-03-22 CN disclosed