Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.33 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.33 |
| ▸ | GLA | P06280 | 1/20 | 0.32 |
| ▸ | TP53 | P04637 | 1/20 | 0.32 |
| ▸ | HBB | P68871 | 1/20 | 0.32 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL21114057 | 0.92 | ALDH1A1 (0.32) | ALDH1A1TDP1GLATP53HBB | |
| Ammonia Solution, Strong SCHEMBL476165 | 0.90 | ALDH1A1 (0.31) | ALDH1A1TDP1GLATP53HBB | |
| SCHEMBL3180847 | 0.84 | — | — | |
| SCHEMBL25400687 | 0.80 | — | — | |
| SCHEMBL142907 | 0.78 | — | — | |
| SCHEMBL960757 | 0.77 | — | — | |
| SCHEMBL1646383 | 0.77 | ALDH1A1 (0.31) | ALDH1A1 | |
| SCHEMBL1643688 | 0.77 | ALDH1A1 (0.31) | ALDH1A1 | |
| SCHEMBL23094088 | 0.75 | CYP3A4 (0.32) | ALDH1A1 | |
| SCHEMBL3156273 | 0.74 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20250277073-A1 | CURABLE COMPOSITION, LAMINATE, AND METHOD FOR PRODUCING LAMINATE | FUJIFILM CORPORATION (JP) | 2025-09-04 | — | — | US | disclosed |
| CN-119014133-A | Laminate-cured body, printed circuit board provided with same, and method for producing laminate-cured body | 太阳控股株式会社 | 2024-11-22 | — | — | CN | disclosed |
| CN-118974657-A | Photosensitive resin composition and method for producing printed wiring board | 太阳控股株式会社 | 2024-11-15 | — | — | CN | disclosed |
| CN-118975414-A | Mounting board, connection structure, and electronic component | 太阳控股株式会社 | 2024-11-15 | — | — | CN | disclosed |
| CN-113196171-B | Curable resin composition, dry film, cured product, and electronic component | 太阳控股株式会社 | 2024-04-23 | — | — | CN | disclosed |