Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 7/20 | 0.64 |
| ▸ | TDP1 | Q9NUW8 | 6/20 | 0.64 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.64 |
| ▸ | TSHR | P16473 | 2/20 | 0.64 |
| ▸ | TEAD4 | Q15561 | 1/20 | 0.58 |
| ▸ | MAPT | P10636 | 5/20 | 0.56 |
| ▸ | POLB | P06746 | 1/20 | 0.56 |
| ▸ | MAOA | P21397 | 2/20 | 0.54 |
| ▸ | SMN1; SMN2 | Q16637 | 3/20 | 0.54 |
| ▸ | MAOB | P27338 | 1/20 | 0.52 |
| ▸ | NPC1 | O15118 | 3/20 | 0.52 |
| ▸ | RAB9A | P51151 | 3/20 | 0.52 |
| ▸ | MAPK1 | P28482 | 2/20 | 0.52 |
| ▸ | HPGD | P15428 | 1/20 | 0.52 |
| ▸ | MEN1 | O00255 | 3/20 | 0.50 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.50 |
| ▸ | MITF | O75030 | 1/20 | 0.50 |
| ▸ | GAA | P10253 | 1/20 | 0.50 |
| ▸ | GFER | P55789 | 1/20 | 0.50 |
| ▸ | NLRP1 | Q9C000 | 1/20 | 0.50 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL12112119 | 1.00 | ALDH1A1 (0.64) | ALDH1A1TDP1CYP3A4TSHRTEAD4 | |
| SCHEMBL14302875 | 0.89 | ALDH1A1 (0.50) | ALDH1A1TDP1CYP3A4TSHRTEAD4 | |
| SCHEMBL9144439 | 0.88 | ALDH1A1 (0.67) | ALDH1A1TDP1CYP3A4TSHRTEAD4 | |
| SCHEMBL1851650 | 0.86 | ALDH1A1 (0.64) | ALDH1A1TDP1CYP3A4TSHRTEAD4 | |
| SCHEMBL8095943 | 0.85 | ESR1 (0.52) | ALDH1A1TDP1CYP3A4TSHRMAPT | |
| SCHEMBL3482829 | 0.85 | ESR1 (0.52) | ALDH1A1TDP1CYP3A4TSHRMAPT | |
| SCHEMBL140799 | 0.85 | ESR1 (0.52) | ALDH1A1TDP1CYP3A4TSHRMAPT | |
| SCHEMBL8164161 | 0.85 | ESR1 (0.52) | ALDH1A1TDP1CYP3A4TSHRMAPT | |
| SCHEMBL8861766 | 0.83 | ALDH1A1 (0.47) | ALDH1A1TDP1CYP3A4TSHRTEAD4 | |
| SCHEMBL8955763 | 0.83 | ALDH1A1 (0.58) | ALDH1A1TDP1CYP3A4TSHRTEAD4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 568 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-5459233-A | High temperature engineering aromatic polyimides | MITSUI TOATSU CHEMICALS, INCORPORATED (JP) | 1995-10-17 | — | — | US | claimed |
| US-5288843-A | Polymerizing 4,4'-bis(3-aminophenoxy)biphenyl, pyromellitic dianhydride and a different aromaticdiamine; engineering plastics; molding mateials; aerospace; heat resistance; melt processibility | MITSUI TOATSU CHEMICALS, INC. (JP) | 1994-02-22 | — | — | US | claimed |
| US-4435560-A | HEAT RESISTANT, GOOD PROCESSABILITY | HITACHI, LTD. (JP) | 1984-03-06 | — | — | US | claimed |
| US-12479194-B2 | Laminate | TOYOBO CO., LTD. (JP) | 2025-11-25 | — | — | US | disclosed |
| US-12472732-B2 | Laminate, method for manufacturing laminate, and method for manufacturing flexible electronic device | TOYOBO CO., LTD. (JP) | 2025-11-18 | — | — | US | disclosed |
| US-12391813-B2 | Layered body including inorganic substrate and polyamic acid cured product | TOYOBO CO., LTD. (JP) | 2025-08-19 | — | — | US | disclosed |
| US-20250019508-A1 | LAYERED BODY INCLUDING INORGANIC SUBSTRATE AND POLYAMIC ACID CURED PRODUCT | TOYOBO CO., LTD. (JP) | 2025-01-16 | — | — | US | disclosed |
| US-12172409-B2 | Laminate of inorganic substrate/polymer film layer with attached protective film, laminate stack, laminate storage method, and laminate transport method | TOYOBO CO., LTD. (JP) | 2024-12-24 | — | — | US | disclosed |
| US-20240375381-A1 | TRANSPARENT HEAT-RESISTANT LAMINATED FILM | TOYOBO CO., LTD. (JP) | 2024-11-14 | — | — | US | disclosed |
| US-12115755-B2 | Laminate of polyimide film and inorganic substrate | TOYOBO CO., LTD. (JP) | 2024-10-15 | — | — | US | disclosed |
| US-20240336033-A1 | LAMINATE | TOYOBO CO., LTD. (JP) | 2024-10-10 | — | — | US | disclosed |
| EP-0294195-A2 | Polyimide resin composition | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1988-12-07 | — | — | EP | disclosed |
| US-4758875-A | Resin encapsulated semiconductor device | HITACHI, LTD. (JP) | 1988-07-19 | — | — | US | disclosed |
| EP-0269319-A2 | Polyimide | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1988-06-01 | — | — | EP | disclosed |
| EP-0032745-B1 | ETHER IMIDES AND PROCESS FOR PRODUCING THE SAME | Hitachi, Ltd. (JP) | 1987-01-07 | — | — | EP | disclosed |
| EP-0047530-B1 | MALEIMIDE RESIN COMPOSITION AND PROCESS FOR ITS PRODUCTION | Hitachi, Ltd. (JP) | 1986-12-10 | — | — | EP | disclosed |
| US-4460783-A | AMIDATION, CYCLIZATION, DEHYDRATION | HITACHI, LTD. (JP) | 1984-07-17 | — | — | US | disclosed |
| US-4435560-A | HEAT RESISTANT, GOOD PROCESSABILITY | HITACHI, LTD. (JP) | 1984-03-06 | — | — | US | disclosed |
| EP-0047530-A2 | Maleimide resin composition and process for its production | Hitachi, Ltd. (JP) | 1982-03-17 | — | — | EP | disclosed |
| EP-0032745-A2 | Ether imides and process for producing the same | Hitachi, Ltd. (JP) | 1981-07-29 | — | — | EP | disclosed |