Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MGLL | Q99685 | 3/20 | 0.48 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.47 |
| ▸ | TP53 | P04637 | 1/20 | 0.43 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.43 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.35 |
| ▸ | MAPT | P10636 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3090220 | 1.00 | MGLL (0.48) | MGLLALDH1A1TP53CYP3A4SMN1; SMN2 | |
| SCHEMBL14218294 | 0.88 | MGLL (0.42) | MGLLALDH1A1TP53CYP3A4 | |
| SCHEMBL25348870 | 0.86 | MGLL (0.46) | MGLLALDH1A1TP53CYP3A4SMN1; SMN2 | |
| SCHEMBL29006366 | 0.86 | MGLL (0.46) | MGLLALDH1A1TP53CYP3A4SMN1; SMN2 | |
| SCHEMBL268635 | 0.85 | MGLL (0.55) | MGLLALDH1A1TP53CYP3A4 | |
| SCHEMBL624267 | 0.85 | MGLL (0.55) | MGLLALDH1A1TP53CYP3A4 | |
| SCHEMBL268634 | 0.85 | MGLL (0.55) | MGLLALDH1A1TP53CYP3A4 | |
| SCHEMBL8054471 | 0.84 | HCAR2 (0.52) | MGLLALDH1A1TP53CYP3A4MAPT | |
| SCHEMBL1286819 | 0.84 | HCAR2 (0.52) | MGLLALDH1A1TP53CYP3A4MAPT | |
| SCHEMBL2834071 | 0.84 | MGLL (0.49) | MGLLALDH1A1TP53CYP3A4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-116003771-A | Synthesis method of alpha, beta-unsaturated carboxylic ester functionalized polymer | 华南理工大学 | 2023-04-25 | — | — | CN | claimed |
| US-20060275700-A1 | Photosensitive resin composition, method of manufacturing a thin-film transistor substrate, and method of manufacturing a common electrode substrate using the same | SAMSUNG ELECTRONICS CO., LTD. | 2006-12-07 | — | — | US | claimed |
| US-12488908-B2 | Electrical cable or electrical cable accessory | NEXANS (FR) | 2025-12-02 | — | — | US | disclosed |
| CN-116003771-B | Synthesis method of alpha, beta-unsaturated carboxylic ester functionalized polymer | 华南理工大学 | 2024-10-01 | — | — | CN | disclosed |
| US-12071506-B2 | Electrical device comprising a cross-linked layer | NEXANS (FR) | 2024-08-27 | — | — | US | disclosed |
| EP-3005377-B1 | MEDIUM-VOLTAGE OR HIGH-VOLTAGE ELECTRICAL DEVICE | NEXANS (FR) | 2024-04-17 | — | — | EP | disclosed |
| CN-112029179-B | Electrical device comprising a crosslinked layer | 耐克森公司 | 2024-03-29 | — | — | CN | disclosed |
| US-20230260671-A1 | ELECTRICAL CABLE OR ELECTRICAL CABLE ACCESSORY | NEXANS (FR) | 2023-08-17 | — | — | US | disclosed |
| EP-4202958-A1 | ELECTRICAL CABLE OR ELECTRICAL CABLE ACCESSORY | Nexans (FR) | 2023-06-28 | — | — | EP | disclosed |
| CN-116313240-A | Cable or cable fitting | 耐克森公司 | 2023-06-23 | — | — | CN | disclosed |
| CN-116003771-A | Synthesis method of alpha, beta-unsaturated carboxylic ester functionalized polymer | 华南理工大学 | 2023-04-25 | — | — | CN | disclosed |
| EP-0361712-B1 | Thermoplastic resin composition | JAPAN SYNTHETIC RUBBER CO LTD (JP) | 1994-03-09 | — | — | EP | disclosed |
| EP-0206179-B1 | MOLDED PRODUCT HAVING PRINTED CIRCUIT BOARD | SHOWA DENKO KABUSHIKI KAISHA (JP) | 1993-03-17 | — | — | EP | disclosed |
| US-5169899-A | Blend of polyamide and styrene resin | JAPAN SYNTHETIC RUBBER CO., LTD. (JP) | 1992-12-08 | — | — | US | disclosed |
| EP-0209740-B1 | HEAT-RESISTANT WIRE | SHOWA DENKO KABUSHIKI KAISHA (JP) | 1989-05-24 | — | — | EP | disclosed |
| US-4826726-A | CROSSLINKED POLYMER SHIELD | SHOWA DENKO KABUSHIKI KAISHA (JP) | 1989-05-02 | — | — | US | disclosed |
| US-4772496-A | Molded product having printed circuit board | SHOWA DENKO KABUSHIKI KAISHA (JP) | 1988-09-20 | — | — | US | disclosed |
| US-4751146-A | Printed circuit boards | SHOWA DENKO KABUSHIKI KAISHA (JP) | 1988-06-14 | — | — | US | disclosed |
| EP-0246329-A1 | SAFETY-GLASS INTERLAYER | SHOWA DENKO KABUSHIKI KAISHA (JP) | 1987-11-25 | — | — | EP | disclosed |
| EP-0206179-A2 | Molded product having printed circuit board | SHOWA DENKO KABUSHIKI KAISHA (JP) | 1986-12-30 | — | — | EP | disclosed |