Predicted protein targets (top 13)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA2 | P00918 | 14/20 | 0.56 |
| ▸ | CA1 | P00915 | 13/20 | 0.52 |
| ▸ | MMP1 | P03956 | 4/20 | 0.52 |
| ▸ | MMP2 | P08253 | 4/20 | 0.52 |
| ▸ | MMP9 | P14780 | 4/20 | 0.52 |
| ▸ | MMP8 | P22894 | 4/20 | 0.52 |
| ▸ | MMP13 | P45452 | 4/20 | 0.52 |
| ▸ | F2 | P00734 | 4/20 | 0.46 |
| ▸ | PRSS1 | P07477 | 4/20 | 0.46 |
| ▸ | PRSS2 | P07478 | 4/20 | 0.46 |
| ▸ | PRSS3 | P35030 | 4/20 | 0.46 |
| ▸ | LMNA | P02545 | 1/20 | 0.36 |
| ▸ | THRB | P10828 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1146132 | 1.00 | CA2 (0.56) | CA2CA1MMP1MMP2MMP9 | |
| SCHEMBL3100188 | 1.00 | CA2 (0.56) | CA2CA1MMP1MMP2MMP9 | |
| SCHEMBL3082432 | 1.00 | CA2 (0.56) | CA2CA1MMP1MMP2MMP9 | |
| SCHEMBL455847 | 0.97 | CA2 (0.52) | CA2CA1MMP1MMP2MMP9 | |
| SCHEMBL1766721 | 0.88 | CA2 (0.42) | CA2CA1MMP1MMP2MMP9 | |
| SCHEMBL9335744 | 0.79 | CA2 (0.59) | CA2CA1MMP1MMP2MMP9 | |
| SCHEMBL7660482 | 0.77 | CA2 (0.56) | CA2CA1MMP1MMP2MMP9 | |
| SCHEMBL585171 | 0.77 | CA2 (0.56) | CA2CA1MMP1MMP2MMP9 | |
| SCHEMBL584864 | 0.77 | CA2 (0.56) | CA2CA1MMP1MMP2MMP9 | |
| SCHEMBL302264 | 0.77 | CA2 (0.56) | CA2CA1MMP1MMP2MMP9 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20230176479-A1 | NEGATIVE RESIST FILM LAMINATE AND PATTERN FORMATION METHOD | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-06-08 | — | — | US | disclosed |
| EP-4167028-A1 | NEGATIVE RESIST FILM LAMINATE AND PATTERN FORMATION METHOD | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-04-19 | — | — | EP | disclosed |
| CN-108107676-B | Chemically amplified positive resist film laminate and pattern formation method | 信越化学工业株式会社 | 2023-02-21 | — | — | CN | disclosed |
| CN-108459469-B | Pattern forming method | 信越化学工业株式会社 | 2022-11-11 | — | — | CN | disclosed |
| US-11460774-B2 | Photosensitive resin composition, photosensitive dry film, and pattern forming process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2022-10-04 | — | — | US | disclosed |
| CN-114600045-A | Photosensitive resin composition, photosensitive dry film and pattern forming method | 信越化学工业株式会社 | 2022-06-07 | — | — | CN | disclosed |
| US-11256174-B2 | Pattern forming process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2022-02-22 | — | — | US | disclosed |
| EP-3671345-B1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMING PROCESS | SHINETSU CHEMICAL CO (JP) | 2022-02-02 | — | — | EP | disclosed |
| WO-2021079679-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMATION METHOD | 信越化学工業株式会社 | 2021-04-29 | — | — | WO | disclosed |
| CN-111338181-A | Photosensitive resin composition, photosensitive dry film and pattern forming method | 信越化学工业株式会社 | 2020-06-26 | — | — | CN | disclosed |
| EP-3367164-B1 | PATTERN FORMING PROCESS | SHINETSU CHEMICAL CO (JP) | 2019-11-13 | — | — | EP | disclosed |
| EP-3327504-B1 | CHEMICALLY AMPLIFIED POSITIVE RESIST FILM LAMINATE AND PATTERN FORMING PROCESS | SHINETSU CHEMICAL CO (JP) | 2019-05-15 | — | — | EP | disclosed |
| EP-3367164-A1 | PATTERN FORMING PROCESS | Shin-Etsu Chemical Co., Ltd. (JP) | 2018-08-29 | — | — | EP | disclosed |
| US-20180239255-A1 | PATTERN FORMING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2018-08-23 | — | — | US | disclosed |
| EP-3327504-A1 | CHEMICALLY AMPLIFIED POSITIVE RESIST FILM LAMINATE AND PATTERN FORMING PROCESS | Shin-Etsu Chemical Co., Ltd. (JP) | 2018-05-30 | — | — | EP | disclosed |
| US-20180143535-A1 | CHEMICALLY AMPLIFIED POSITIVE RESIST FILM LAMINATE AND PATTERN FORMING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2018-05-24 | — | — | US | disclosed |
| US-7799469-B2 | electrolytic salt e.g. LiPF6 is dissolved in an organic solvent ( ethylene carbonate, vinyline carbonate, diethyl carbonate) and a silicon compound additive; increase of internal resistance in storage at high temperature; stable power souce for hybrid or battery cars using electrical power; green energy | DENSO CORPORATION (JP) | 2010-09-21 | — | — | US | disclosed |
| US-20090253881-A1 | POLYMERIZABLE COMPOUND FOR PHOTORESIST, POLYMER THEREOF, AND PHOTORESIST COMPOSITION CONTAINING SUCH POLYMER | IDEMITSU KOSAN CO., LTD. (JP) | 2009-10-08 | — | — | US | disclosed |
| EP-1882705-A1 | POLYMERIZABLE COMPOUND FOR PHOTORESIST, POLYMER THEREOF, AND PHOTORESIST COMPOSITION CONTAINING SUCH POLYMER | IDEMITSU KOSAN CO., LTD. (JP) | 2008-01-30 | — | — | EP | disclosed |
| US-20070243470-A1 | electrolytic salt e.g. LiPF6 is dissolved in an organic solvent ( ethylene carbonate, vinyline carbonate, diethyl carbonate) and a silicon compound additive; increase of internal resistance in storage at high temperature; stable power souce for hybrid or battery cars using electrical power; green energy | DENSO CORPORATION (JP) | 2007-10-18 | — | — | US | disclosed |