⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL21870195 | 0.78 | HPGD (0.31) | — | |
| SCHEMBL187953 | 0.78 | ACHE (0.35) | — | |
| SCHEMBL21870214 | 0.76 | HPGD (0.30) | — | |
| SCHEMBL29198685 | 0.75 | CA12 (0.38) | — | |
| Fluoride SCHEMBL27902328 | 0.73 | CA12 (0.36) | — | |
| SCHEMBL148576 | 0.73 | — | — | |
| SCHEMBL12749092 | 0.72 | NQO1 (0.46) | — | |
| SCHEMBL28566610 | 0.71 | ALDH1A1 (0.61) | — | |
| SCHEMBL28777129 | 0.71 | CA1 (0.52) | — | |
| SCHEMBL27759346 | 0.71 | ALDH1A1 (0.52) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 310 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118956107-A | PBT composite material containing halogen-free flame retardant and preparation method thereof | 广东君邦新材料科技有限公司 | 2024-11-15 | — | — | CN | claimed |
| US-8920931-B2 | Phosphosiloxane resins, and curable silicone compositions, free-standing films, and laminates comprising the phosphosiloxane resins | DOW CORNING CORPORATION (US) | 2014-12-30 | — | — | US | claimed |
| EP-2609137-A1 | PHOSPHOSILOXANE RESINS, AND CURABLE SILICONE COMPOSITIONS, FREE-STANDING FILMS, AND LAMINATES COMPRISING THE PHOSPHOSILOXANE RESINS | Dow Corning Corporation (US) | 2013-07-03 | — | — | EP | claimed |
| US-20130149520-A1 | PHOSPHOSILOXANE RESINS, AND CURABLE SILICONE COMPOSITIONS, FREE-STANDING FILMS, AND LAMINATES COMPRISING THE PHOSPHOSILOXANE RESINS | DOW CORNING CORPORATION (US) | 2013-06-13 | — | — | US | claimed |
| WO-2012027337-A1 | PHOSPHOSILOXANE RESINS, AND CURABLE SILICONE COMPOSITIONS, FREE-STANDING FILMS, AND LAMINATES COMPRISING THE PHOSPHOSILOXANE RESINS | DOW CORNING CORPORATION (US) | 2012-03-01 | — | — | WO | claimed |
| EP-1483112-B1 | HYDROSILYLATION CURE OF SILICONE RESIN CONTAINING COLLOIDAL SILICA AND A PROCESS FOR PRODUCING THE SAME | MASSACHUSETTS INST TECHNOLOGY (US) | 2006-12-06 | — | — | EP | claimed |
| US-5457074-A | Diorganosilacetylene-alt-diorganosilvinylene polymers and a process of preparation | IOWA STATE UNIVERSITY RESEARCH FOUNDATION, INC. (US) | 1995-10-10 | — | — | US | claimed |
| US-12454617-B2 | Silicone elastomer compositions | DOW SILICONES CORPORATION (US) | 2025-10-28 | — | — | US | disclosed |
| US-12378443-B2 | Silicone elastomer compositions | DOW SILICONES CORPORATION (US) | 2025-08-05 | — | — | US | disclosed |
| US-12378456-B2 | Inflatable safety devices | DOW SILICONES CORPORATION (US) | 2025-08-05 | — | — | US | disclosed |
| WO-2025090429-A1 | SILICONE ELASTOMER COMPOSITIONS | DOW SILICONES CORPORATION (US) | 2025-05-01 | — | — | WO | disclosed |
| CN-118599275-B | Flame-retardant antibacterial PETG material, preparation method and application thereof in medical packaging | 东莞市万塑成塑料有限公司 | 2025-02-11 | — | — | CN | disclosed |
| EP-4291615-B1 | SILICONE ELASTOMER COMPOSITIONS | DOW SILICONES CORP (US) | 2024-12-04 | — | — | EP | disclosed |
| EP-1362364-A2 | SEMICONDUCTOR PACKAGE AND METHOD OF PREPARING SAME | Dow Corning Corporation (US) | 2003-11-19 | — | — | EP | disclosed |
| US-6617674-B2 | Wafer having an active surface comprising an integrated circuit having bond pads; and a cured silicone layer covering the surface of the wafer, provided at least a portion of each bond pad is not covered with the silicone layer | DOW CORNING CORPORATION | 2003-09-09 | — | — | US | disclosed |
| US-20020158317-A1 | Semiconductor package and method of preparing same | DOW SILICONES CORPORATION | 2002-10-31 | — | — | US | disclosed |
| WO-2002067292-A2 | SEMICONDUCTOR PACKAGE AND METHOD OF PREPARING SAME | DOW CORNING CORPORATION (US) | 2002-08-29 | — | — | WO | disclosed |
| US-5457074-A | Diorganosilacetylene-alt-diorganosilvinylene polymers and a process of preparation | IOWA STATE UNIVERSITY RESEARCH FOUNDATION, INC. (US) | 1995-10-10 | — | — | US | disclosed |
| US-5312649-A | Diorganosilacetylene-alt-diorganosilvinylene polymers and a process densifying porous silicon-carbide bodies | IOWA STATE UNIVERSITY RESEARCH FOUNDATION, INC. (US) | 1994-05-17 | — | — | US | disclosed |
| US-5241029-A | Forms silicon carbide upon heating | IOWA STATE UNIVERSITY RESEARCH FOUNDATION, INC. (US) | 1993-08-31 | — | — | US | disclosed |