SCHEMBL30917331

SCHEMBL30917331

O=C(O)c1cc(C(=O)Cl)cc([N+](=O)[O-])c1

nearest known ligand 0.58

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.58
TSHR P16473 1/20 0.58
TP53 P04637 1/20 0.55
TDP1 Q9NUW8 1/20 0.52
CYP3A4 P08684 1/20 0.50
SMN1; SMN2 Q16637 1/20 0.50
MEN1 O00255 3/20 0.47
KMT2A Q03164 3/20 0.47
SRD5A2 P31213 1/20 0.47
ATM Q13315 1/20 0.45
ALOX5 P09917 2/20 0.44
LMNA P02545 1/20 0.43
CA1 P00915 1/20 0.43
CA2 P00918 1/20 0.43
CASP6 P55212 1/20 0.43
CES2 O00748 1/20 0.43
CES1 P23141 1/20 0.43
MAPT P10636 2/20 0.43
CASR P41180 1/20 0.43
KDM4E B2RXH2 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7596117 1.00 ALDH1A1 (0.58) ALDH1A1TSHRTP53TDP1CYP3A4
SCHEMBL12501661 1.00 ALDH1A1 (0.58) ALDH1A1TSHRTP53TDP1CYP3A4
SCHEMBL28559760 0.94 TP53 (0.60) ALDH1A1TSHRTP53TDP1CYP3A4
SCHEMBL728757 0.92 ALDH1A1 (0.66) ALDH1A1TSHRTP53TDP1CYP3A4
SCHEMBL232779 0.90 TP53 (0.64) ALDH1A1TSHRTP53TDP1CYP3A4
SCHEMBL8060267 0.88 TP53 (0.62) ALDH1A1TP53TDP1CYP3A4SMN1; SMN2
Hydrochloric Acid SCHEMBL2299193 0.88 TP53 (0.62) ALDH1A1TSHRTP53TDP1CYP3A4
Hydrochloric Acid SCHEMBL3088495 0.88 TP53 (0.62) ALDH1A1TSHRTP53TDP1CYP3A4
Methane SCHEMBL7896214 0.88 TP53 (0.62) ALDH1A1TSHRTP53TDP1CYP3A4
SCHEMBL9133420 0.88 TP53 (0.62) ALDH1A1TSHRTP53TDP1CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118108621-A Diamine compound, heat-resistant resin, resin composition, cured film, and electronic component 东友精细化工有限公司 2024-05-31 CN disclosed