SCHEMBL31010761

SCHEMBL31010761

CCCCCCC(CCCCC)c1ccc(S(N)(=O)=O)cc1

nearest known ligand 0.63

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
NR1I2 O75469 1/20 0.63
CA2 P00918 18/20 0.56
SMN1; SMN2 Q16637 1/20 0.53
CA1 P00915 10/20 0.51
CA9 Q16790 6/20 0.51
CA7 P43166 6/20 0.51
CA12 O43570 5/20 0.51
TSHR P16473 1/20 0.51
CA5A P35218 1/20 0.51
CA5B Q9Y2D0 1/20 0.51
CA4 P22748 1/20 0.48
CA14 Q9ULX7 1/20 0.46
ALDH1A1 P00352 1/20 0.45
CA13 Q8N1Q1 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL38651153 0.98 NR1I2 (0.60) NR1I2CA2SMN1; SMN2CA1CA9
SCHEMBL9450366 0.93 CA2 (0.56) NR1I2CA2SMN1; SMN2CA1CA9
SCHEMBL28184549 0.89 NR1I2 (0.55) NR1I2CA2SMN1; SMN2CA1CA9
SCHEMBL19332936 0.85 NR1I2 (0.65) NR1I2CA2
SCHEMBL22333698 0.85 NR1I2 (0.65) NR1I2CA2
SCHEMBL19627845 0.83 NR1I2 (0.63) NR1I2CA2TSHRALDH1A1
SCHEMBL4310857 0.83 NR1I2 (0.63) NR1I2CA2TSHRALDH1A1
SCHEMBL6128184 0.83 NR1I2 (0.63) NR1I2CA2TSHRALDH1A1
SCHEMBL27214770 0.83 NR1I2 (0.63) NR1I2CA2TSHRALDH1A1
SCHEMBL15269486 0.83 NR1I2 (0.88) NR1I2CA2TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3893054-B1 PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE FUJIFILM CORP (JP) 2026-05-06 EP disclosed
US-12393116-B2 Pattern forming method, photosensitive resin composition, cured film, laminate, and device FUJIFILM CORPORATION (JP) 2025-08-19 US disclosed
EP-3893053-B1 PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, MULTILAYER BODY AND DEVICE FUJIFILM CORP (JP) 2025-01-22 EP disclosed
US-12078929-B2 Photosensitive resin composition, pattern forming method, cured film, laminate, and device FUJIFILM CORPORATION (JP) 2024-09-03 US disclosed