Phenol

Phenol

SCHEMBL31015754

CC(C(=O)O)c1cccc(S)c1.CC(C(=O)O)c1cccc(S)c1.Oc1ccccc1.Oc1ccccc1

nearest known ligand 0.55

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PTGS1 P23219 6/20 0.55
PTGS2 P35354 5/20 0.55
MAPT P10636 4/20 0.55
LMNA P02545 3/20 0.55
HIF1A Q16665 3/20 0.55
CXCR1 P25024 2/20 0.55
CXCR2 P25025 2/20 0.55
SMN1; SMN2 Q16637 2/20 0.55
CYP3A4 P08684 2/20 0.55
HPGD P15428 2/20 0.55
SLC22A6 Q4U2R8 2/20 0.55
KDM4E B2RXH2 2/20 0.55
RECQL P46063 1/20 0.55
ALDH1A1 P00352 1/20 0.55
MAPK1 P28482 1/20 0.55
PMP22 Q01453 1/20 0.55
HSD17B10 Q99714 1/20 0.55
CXCL8 P10145 1/20 0.55
THPO P40225 1/20 0.55
AKR1C3 P42330 3/20 0.49

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2392981 0.92 PTGS1 (0.59) PTGS1PTGS2MAPTLMNAHIF1A
SCHEMBL490681 0.83 PTGS1 (0.61) PTGS1PTGS2MAPTLMNAHIF1A
SCHEMBL3858080 0.83 PTGS1 (0.61) PTGS1PTGS2MAPTLMNAHIF1A
Phenol SCHEMBL27926442 0.82 PTGS2 (0.64) PTGS1PTGS2MAPTLMNAHIF1A
SCHEMBL602096 0.78 PTGS2 (0.69) PTGS1PTGS2MAPTLMNAHIF1A
Phosphoric Acid SCHEMBL27934163 0.77 AKR1C3 (0.55) PTGS1PTGS2MAPTLMNAHIF1A
SCHEMBL1679511 0.75 PTGS2 (0.61) PTGS1PTGS2MAPTLMNAHIF1A
SCHEMBL23581099 0.74 PTGS2 (0.75) PTGS1PTGS2MAPTLMNAHIF1A
SCHEMBL3418 0.74 PTGS2 (0.75) PTGS1PTGS2MAPTLMNAHIF1A
SCHEMBL66842 0.74 PTGS2 (0.75) PTGS1PTGS2MAPTLMNAHIF1A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114269848-B Composition for forming heat conductive material, heat conductive sheet, and device with heat conductive layer 富士胶片株式会社 2024-07-16 CN disclosed