SCHEMBL31147823

SCHEMBL31147823

CCOC(=O)N(c1ccccc1)c1ccccc1.[Na]

nearest known ligand 0.53

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
L3MBTL1 Q9Y468 2/20 0.53
ATM Q13315 1/20 0.53
TDP1 Q9NUW8 1/20 0.53
CTDSP1 Q9GZU7 1/20 0.51
ALDH1A1 P00352 5/20 0.51
HSD17B10 Q99714 2/20 0.51
MAPT P10636 2/20 0.51
CYP1A2 P05177 1/20 0.51
CYP2C9 P11712 1/20 0.51
HPGD P15428 1/20 0.51
CYP2C19 P33261 1/20 0.51
NPSR1 Q6W5P4 3/20 0.50
KMT2A Q03164 2/20 0.50
SMN1; SMN2 Q16637 2/20 0.50
POLB P06746 2/20 0.50
MEN1 O00255 1/20 0.50
NPC1 O15118 1/20 0.50
HTT P42858 1/20 0.50
RAB9A P51151 1/20 0.50
LMNA P02545 1/20 0.49

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1363531 0.98 L3MBTL1 (0.55) L3MBTL1ATMTDP1CTDSP1ALDH1A1
Hydrochloric Acid SCHEMBL27606948 0.96 L3MBTL1 (0.53) L3MBTL1ATMTDP1CTDSP1ALDH1A1
Ethylene SCHEMBL9312122 0.94 L3MBTL1 (0.52) L3MBTL1ATMTDP1CTDSP1ALDH1A1
SCHEMBL27480292 0.91 PTGIR (0.58) L3MBTL1ATMTDP1CTDSP1ALDH1A1
SCHEMBL9216374 0.91 PTGIR (0.51) L3MBTL1ATMTDP1CTDSP1ALDH1A1
SCHEMBL3626291 0.90 L3MBTL1 (0.47) L3MBTL1ATMTDP1CTDSP1ALDH1A1
SCHEMBL27489900 0.88 PTGIR (0.55) L3MBTL1ATMTDP1CTDSP1ALDH1A1
SCHEMBL11109783 0.88 CTDSP1 (0.49) L3MBTL1ATMTDP1CTDSP1ALDH1A1
Resorcinol SCHEMBL11662367 0.87 PTGIR (0.45) L3MBTL1ATMTDP1CTDSP1ALDH1A1
SCHEMBL7717228 0.85 ALDH1A1 (0.44) L3MBTL1ATMTDP1CTDSP1ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118745586-A Electroplating additive for controlling generation of tin mud, electroplating liquid and production method of tin plate 武汉钢铁有限公司 2024-10-08 CN disclosed