SCHEMBL3128128

SCHEMBL3128128

[Bi+3].[La+3].[O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4]

nearest known ligand 0.00

Known targets — ChEMBL curated mechanism

HRH2

The experimentally established mechanism targets of None. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4650614 0.87
SCHEMBL29403228 0.87
SCHEMBL29637678 0.87
SCHEMBL16681692 0.87
SCHEMBL4817502 0.87
SCHEMBL30525357 0.87
SCHEMBL29474233 0.87
SCHEMBL1310370 0.87
SCHEMBL1116072 0.87
SCHEMBL1981104 0.75

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20100123176-A1 SEMICONDUCTOR MEMORY DEVICE KABUSHIKI KAISHA TOSHIBA (JP) 2010-05-20 US claimed
US-20220328651-A1 Semiconducting Ferroelectric Device with Silicon Doped Electrode CERFE LABS, INC. 2022-10-13 US disclosed
WO-2022197706-A2 SEMICONDUCTING FERROELECTRIC DEVICE CERFE LABS, INC. (US) 2022-09-22 WO disclosed
US-20220293766-A1 Semiconducting Ferroelectric Device CERFE LABS, INC. 2022-09-15 US disclosed
CN-109037317-B Ferroelectric memory device 爱思开海力士有限公司 2021-09-10 CN disclosed
US-10475924-B2 Ferroelectric memory devices SK Hynix Inc. (KR) 2019-11-12 US disclosed
US-10374011-B2 Resistance change memory devices SK Hynix Inc. (KR) 2019-08-06 US disclosed
US-20180358410-A1 RESISTANCE CHANGE MEMORY DEVICES SK Hynix Inc. (KR) 2018-12-13 US disclosed
US-20180358471-A1 FERROELECTRIC MEMORY DEVICES SK Hynix Inc. (KR) 2018-12-13 US disclosed
US-20070062414-A1 Coating solutions for use in forming bismuth-based ferroelectric thin films and a method of forming bismuth-based ferroelectric thin films using the coating solutions SATO YOSHIMI 2007-03-22 US disclosed
US-6785119-B2 Ferroelectric capacitor and process for its manufacture INFINEON TECHNOLOGIES AG (DE) 2004-08-31 US disclosed
US-6773979-B2 Method for fabricating semiconductor device MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 2004-08-10 US disclosed
WO-2004053949-A1 FERROELECTRIC CAPACITOR AND PROCESS FOR ITS MANUFACTURE INFINEON TECHNOLOGIES AG (DE) 2004-06-24 WO disclosed
WO-2004051711-A2 FERROELECTRIC CAPACITOR AND PROCESS FOR ITS MANUFACTURE INFINEON TECHNOLOGIES AG (DE) 2004-06-17 WO disclosed
US-20040109280-A1 Ferroelectric capacitor and process for its manufacture QIMONDA AG (DE) 2004-06-10 US disclosed
US-20040105213-A1 Ferroelectric capacitor and process for its manufacture QIMONDA AG (DE) 2004-06-03 US disclosed
US-20040055509-A1 Coating solutions for use in forming bismuth-based ferroelectric thin films and a method of forming bismuth-based ferroelectric thin films using the coating solutions SATO YOSHIMI (JP) 2004-03-25 US disclosed
US-20040051126-A1 Compositionally engineered CexMnyO3 and semiconductor devices based thereon STRUCTURED MATERIALS INC. 2004-03-18 US disclosed
US-20020106816-A1 Method for fabricating semiconductor device PANNOVA SEMIC, LLC 2002-08-08 US disclosed
US-20010022990-A1 Coating solutions for use in forming bismuth-based ferroelectric thin films and a method of forming bismuth-based ferroelectric thin films using the coating solutions TOKYO OHKA KOGYO CO., LTD. (JP) 2001-09-20 US disclosed