SCHEMBL3130583

SCHEMBL3130583

Clc1ccc(-c2nc(-c3ccccc3)c[nH]2)cc1Cl

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CXCR2 P25025 1/20 0.48
NPY5R Q15761 2/20 0.45
MAPK13 O15264 1/20 0.45
RAF1 P04049 1/20 0.45
MAPK12 P53778 1/20 0.45
MAPK11 Q15759 1/20 0.45
MAPK14 Q16539 1/20 0.45
NOTUM Q6P988 1/20 0.43
MEN1 O00255 2/20 0.42
ALDH1A1 P00352 2/20 0.42
HPGD P15428 2/20 0.42
KMT2A Q03164 2/20 0.42
L3MBTL1 Q9Y468 2/20 0.42
SMN1; SMN2 Q16637 2/20 0.42
ADORA1 P30542 2/20 0.41
KMO O15229 3/20 0.41
AHR P35869 1/20 0.41
EIF4E P06730 1/20 0.40
ADORA2A P29274 1/20 0.40
IDO1 P14902 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31305411 0.95 MAPK13 (0.49) CXCR2NPY5RMAPK13RAF1MAPK12
SCHEMBL2944949 0.95 MAPK13 (0.49) CXCR2NPY5RMAPK13RAF1MAPK12
SCHEMBL26464210 0.85 PBRM1 (0.44) CXCR2NPY5RADORA1KMOADORA2A
SCHEMBL17280181 0.83 MEN1 (0.43) MEN1ALDH1A1HPGDKMT2AL3MBTL1
SCHEMBL17279786 0.83 MEN1 (0.46) MEN1ALDH1A1HPGDKMT2AL3MBTL1
SCHEMBL26113142 0.82 CXCR2 (0.49) CXCR2MAPK13RAF1MAPK12MAPK11
SCHEMBL31305506 0.82 CXCR2 (0.49) CXCR2MAPK13RAF1MAPK12MAPK11
SCHEMBL28404729 0.82 NPY5R (0.59) NPY5RMAPK13RAF1MAPK12MAPK11
SCHEMBL3136907 0.81 NR1H2 (0.51) CXCR2MAPK13RAF1MAPK12MAPK11
SCHEMBL3140919 0.81 NR1H2 (0.51) CXCR2MAPK13RAF1MAPK12MAPK11

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250215572-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY SHIKOKU CHEMICALS CORPORATION (JP) 2025-07-03 US disclosed
EP-4506488-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY Shikoku Chemicals Corporation (JP) 2025-02-12 EP disclosed
CN-118922584-A Surface treating agent for copper or copper alloy 四国化成工业株式会社 2024-11-08 CN disclosed
WO-2023190263-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY 四国化成工業株式会社 2023-10-05 WO disclosed
EP-1605078-B1 SOLDERING PROCESS USING IMIDAZOLE COMPOUND SHIKOKU CHEM (JP) 2010-07-21 EP disclosed
US-7661577-B2 Treating copper or copper alloy surface for lead-free soldering by treating with imidazole compound such as 2-(2,3-dichlorophenyl)-4-phenyl-5-methylimidazole SHIKOKU CHEMICALS CORPORATION (JP) 2010-02-16 US disclosed
US-20070113930-A1 Novel imidazole compound and use thereof SHIKOKU CHEMICALS CORPORATION (JP) 2007-05-24 US disclosed
EP-1605078-A1 NOVEL IMIDAZOLE COMPOUND AND USAGE THEREOF SHIKOKU CHEMICALS CORPORATION (JP) 2005-12-14 EP disclosed