Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MAPK13 | O15264 | 1/20 | 0.49 |
| ▸ | RAF1 | P04049 | 1/20 | 0.49 |
| ▸ | MAPK12 | P53778 | 1/20 | 0.49 |
| ▸ | MAPK11 | Q15759 | 1/20 | 0.49 |
| ▸ | MAPK14 | Q16539 | 1/20 | 0.49 |
| ▸ | NPY5R | Q15761 | 2/20 | 0.46 |
| ▸ | CXCR2 | P25025 | 1/20 | 0.46 |
| ▸ | NOTUM | Q6P988 | 1/20 | 0.43 |
| ▸ | ADORA1 | P30542 | 1/20 | 0.42 |
| ▸ | KMO | O15229 | 6/20 | 0.42 |
| ▸ | AHR | P35869 | 1/20 | 0.42 |
| ▸ | EIF4E | P06730 | 1/20 | 0.41 |
| ▸ | IDO1 | P14902 | 1/20 | 0.41 |
| ▸ | SMN1; SMN2 | Q16637 | 3/20 | 0.40 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.40 |
| ▸ | NPC1 | O15118 | 2/20 | 0.40 |
| ▸ | RAB9A | P51151 | 2/20 | 0.40 |
| ▸ | NFKB1 | P19838 | 1/20 | 0.40 |
| ▸ | NFKB2 | Q00653 | 1/20 | 0.40 |
| ▸ | RELA | Q04206 | 1/20 | 0.40 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL31305411 | 1.00 | MAPK13 (0.49) | MAPK13RAF1MAPK12MAPK11MAPK14 | |
| SCHEMBL3130583 | 0.95 | CXCR2 (0.48) | MAPK13RAF1MAPK12MAPK11MAPK14 | |
| SCHEMBL28399045 | 0.85 | NPY5R (0.54) | MAPK13RAF1MAPK12MAPK11MAPK14 | |
| SCHEMBL26464210 | 0.83 | PBRM1 (0.44) | NPY5RCXCR2ADORA1KMOIDO1 | |
| SCHEMBL28404729 | 0.83 | NPY5R (0.59) | MAPK13RAF1MAPK12MAPK11MAPK14 | |
| SCHEMBL3140919 | 0.83 | NR1H2 (0.51) | MAPK13RAF1MAPK12MAPK11MAPK14 | |
| SCHEMBL3136907 | 0.83 | NR1H2 (0.51) | MAPK13RAF1MAPK12MAPK11MAPK14 | |
| SCHEMBL7139559 | 0.82 | HPGDS (0.43) | MAPK13RAF1MAPK12MAPK11MAPK14 | |
| SCHEMBL4847155 | 0.82 | HPGDS (0.43) | MAPK13RAF1MAPK12MAPK11MAPK14 | |
| SCHEMBL17279780 | 0.82 | MEN1 (0.43) | ADORA1SMN1; SMN2KDM4ENPC1RAB9A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7661577-B2 | Treating copper or copper alloy surface for lead-free soldering by treating with imidazole compound such as 2-(2,3-dichlorophenyl)-4-phenyl-5-methylimidazole | SHIKOKU CHEMICALS CORPORATION (JP) | 2010-02-16 | — | — | US | claimed |
| US-20250215572-A1 | SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY | SHIKOKU CHEMICALS CORPORATION (JP) | 2025-07-03 | — | — | US | disclosed |
| EP-4506488-A1 | SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY | Shikoku Chemicals Corporation (JP) | 2025-02-12 | — | — | EP | disclosed |
| WO-2023190263-A1 | SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY | 四国化成工業株式会社 | 2023-10-05 | — | — | WO | disclosed |
| EP-1886759-B1 | WATER-SOLUBLE PREFLUX AND USE THEREOF | SHIKOKU CHEM (JP) | 2016-10-05 | — | — | EP | disclosed |
| EP-1605078-B1 | SOLDERING PROCESS USING IMIDAZOLE COMPOUND | SHIKOKU CHEM (JP) | 2010-07-21 | — | — | EP | disclosed |
| EP-1605078-B1 | SOLDERING PROCESS USING IMIDAZOLE COMPOUND | SHIKOKU CHEM (JP) | 2010-07-21 | — | — | EP | disclosed |
| US-7754105-B2 | Water-soluble preflux and usage of the same | SHIKOKU CHEMICALS CORPORATION (JP) | 2010-07-13 | — | — | US | disclosed |
| US-7661577-B2 | Treating copper or copper alloy surface for lead-free soldering by treating with imidazole compound such as 2-(2,3-dichlorophenyl)-4-phenyl-5-methylimidazole | SHIKOKU CHEMICALS CORPORATION (JP) | 2010-02-16 | — | — | US | disclosed |
| US-7661577-B2 | Treating copper or copper alloy surface for lead-free soldering by treating with imidazole compound such as 2-(2,3-dichlorophenyl)-4-phenyl-5-methylimidazole | SHIKOKU CHEMICALS CORPORATION (JP) | 2010-02-16 | — | — | US | disclosed |
| US-7661577-B2 | Treating copper or copper alloy surface for lead-free soldering by treating with imidazole compound such as 2-(2,3-dichlorophenyl)-4-phenyl-5-methylimidazole | SHIKOKU CHEMICALS CORPORATION (JP) | 2010-02-16 | — | — | US | disclosed |
| US-20080318070-A1 | Water-Soluble Preflux and Usage of the Same | SHIKOKU CHEMICALS CORPORATION (JP) | 2008-12-25 | — | — | US | disclosed |
| EP-1886759-A1 | WATER-SOLUBLE PREFLUX AND USE THEREOF | SHIKOKU CHEMICALS CORPORATION (JP) | 2008-02-13 | — | — | EP | disclosed |
| US-20070113930-A1 | Novel imidazole compound and use thereof | SHIKOKU CHEMICALS CORPORATION (JP) | 2007-05-24 | — | — | US | disclosed |
| US-20070113930-A1 | Novel imidazole compound and use thereof | SHIKOKU CHEMICALS CORPORATION (JP) | 2007-05-24 | — | — | US | disclosed |
| US-20070113930-A1 | Novel imidazole compound and use thereof | SHIKOKU CHEMICALS CORPORATION (JP) | 2007-05-24 | — | — | US | disclosed |
| EP-1605078-A1 | NOVEL IMIDAZOLE COMPOUND AND USAGE THEREOF | SHIKOKU CHEMICALS CORPORATION (JP) | 2005-12-14 | — | — | EP | disclosed |