SCHEMBL3133251

SCHEMBL3133251

CC(=O)C(=O)c1ccc(Cl)cc1Cl

nearest known ligand 0.61

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SMN1; SMN2 Q16637 2/20 0.61
TSHR P16473 1/20 0.61
CASP1 P29466 1/20 0.61
ALDH1A1 P00352 3/20 0.55
MEN1 O00255 2/20 0.55
KMT2A Q03164 2/20 0.55
MAPK1 P28482 1/20 0.55
HIF1A Q16665 1/20 0.55
MAPT P10636 3/20 0.53
KDM4E B2RXH2 1/20 0.53
GABRA1 P14867 6/20 0.50
GABRG2 P18507 6/20 0.50
GABRB3 P28472 6/20 0.50
GABRB2 P47870 4/20 0.50
POLB P06746 3/20 0.50
GABRB1 P18505 2/20 0.50
THRB P10828 1/20 0.50
RECQL P46063 1/20 0.50
TDP1 Q9NUW8 1/20 0.50
L3MBTL1 Q9Y468 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8065539 0.87 SMN1; SMN2 (0.71) SMN1; SMN2TSHRCASP1ALDH1A1MEN1
SCHEMBL29384783 0.83 TSHR (0.65) SMN1; SMN2TSHRCASP1ALDH1A1MEN1
SCHEMBL322161 0.83 TSHR (0.65) SMN1; SMN2TSHRCASP1ALDH1A1MEN1
SCHEMBL11237581 0.81 TSHR (0.53) SMN1; SMN2TSHRCASP1ALDH1A1MEN1
SCHEMBL8076140 0.81 MEN1 (0.62) SMN1; SMN2TSHRCASP1ALDH1A1MEN1
SCHEMBL11237579 0.81 TSHR (0.53) SMN1; SMN2TSHRCASP1ALDH1A1MEN1
SCHEMBL1697496 0.81 TSHR (0.69) SMN1; SMN2TSHRCASP1ALDH1A1MEN1
SCHEMBL10791990 0.79 SMN1; SMN2 (0.61) SMN1; SMN2TSHRCASP1ALDH1A1MEN1
SCHEMBL9652013 0.79 TSHR (0.60) SMN1; SMN2TSHRCASP1ALDH1A1MEN1
SCHEMBL2704261 0.79 ALDH1A1 (0.58) SMN1; SMN2TSHRCASP1ALDH1A1MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1605078-B1 SOLDERING PROCESS USING IMIDAZOLE COMPOUND SHIKOKU CHEM (JP) 2010-07-21 EP disclosed
US-7661577-B2 Treating copper or copper alloy surface for lead-free soldering by treating with imidazole compound such as 2-(2,3-dichlorophenyl)-4-phenyl-5-methylimidazole SHIKOKU CHEMICALS CORPORATION (JP) 2010-02-16 US disclosed
US-20070113930-A1 Novel imidazole compound and use thereof SHIKOKU CHEMICALS CORPORATION (JP) 2007-05-24 US disclosed
EP-1605078-A1 NOVEL IMIDAZOLE COMPOUND AND USAGE THEREOF SHIKOKU CHEMICALS CORPORATION (JP) 2005-12-14 EP disclosed