SCHEMBL3137293

SCHEMBL3137293

Clc1cccc(Cl)c1-c1c[nH]c(-c2ccccc2)n1

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GUSB P08236 1/20 0.40
HPGD P15428 3/20 0.38
NR1H2 P55055 3/20 0.38
NR1H3 Q13133 3/20 0.38
RAB9A P51151 2/20 0.38
SMN1; SMN2 Q16637 2/20 0.38
TP53 P04637 2/20 0.38
CYP3A4 P08684 2/20 0.38
NPC1 O15118 1/20 0.38
CYP1A2 P05177 1/20 0.38
ALPL P05186 1/20 0.38
CYP2D6 P10635 1/20 0.38
CYP2C9 P11712 1/20 0.38
CYP2C19 P33261 1/20 0.38
MEN1 O00255 5/20 0.36
KMT2A Q03164 5/20 0.36
JAK2 O60674 2/20 0.36
MAPK14 Q16539 2/20 0.36
MAPK13 O15264 1/20 0.36
RAF1 P04049 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28406433 0.87 JAK2 (0.51) SMN1; SMN2JAK2MAPK14MAPK13RAF1
SCHEMBL3136877 0.86 GUSB (0.43) GUSBHPGDNR1H2NR1H3RAB9A
SCHEMBL28402334 0.83 NPY5R (0.45) SMN1; SMN2TP53CYP3A4CYP1A2JAK2
SCHEMBL26110810 0.83 NPC1 (0.49) GUSBHPGDNR1H2NR1H3RAB9A
SCHEMBL28406040 0.82 IDO1 (0.35) GUSBJAK2
SCHEMBL3130628 0.82 IDO1 (0.44) HPGDNR1H2NR1H3RAB9ASMN1; SMN2
SCHEMBL31305593 0.82 IDO1 (0.44) HPGDNR1H2NR1H3RAB9ASMN1; SMN2
SCHEMBL14060462 0.80 PDGFRB (0.38) CYP3A4NPC1CYP2C9CYP2C19JAK2
SCHEMBL17279780 0.80 MEN1 (0.43) HPGDNR1H2NR1H3RAB9ASMN1; SMN2
SCHEMBL3136969 0.79 MAPK13 (0.49) HPGDNR1H2NR1H3SMN1; SMN2TP53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250215572-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY SHIKOKU CHEMICALS CORPORATION (JP) 2025-07-03 US disclosed
EP-4506488-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY Shikoku Chemicals Corporation (JP) 2025-02-12 EP disclosed
CN-118922584-A Surface treating agent for copper or copper alloy 四国化成工业株式会社 2024-11-08 CN disclosed
WO-2023190263-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY 四国化成工業株式会社 2023-10-05 WO disclosed
EP-1605078-B1 SOLDERING PROCESS USING IMIDAZOLE COMPOUND SHIKOKU CHEM (JP) 2010-07-21 EP disclosed
US-7661577-B2 Treating copper or copper alloy surface for lead-free soldering by treating with imidazole compound such as 2-(2,3-dichlorophenyl)-4-phenyl-5-methylimidazole SHIKOKU CHEMICALS CORPORATION (JP) 2010-02-16 US disclosed
US-20070113930-A1 Novel imidazole compound and use thereof SHIKOKU CHEMICALS CORPORATION (JP) 2007-05-24 US disclosed
EP-1605078-A1 NOVEL IMIDAZOLE COMPOUND AND USAGE THEREOF SHIKOKU CHEMICALS CORPORATION (JP) 2005-12-14 EP disclosed