SCHEMBL31429535

SCHEMBL31429535

CCCCc1nc(-c2ccccc2O)[nH]c1C

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SMPD3 Q9NY59 1/20 0.52
KDM4E B2RXH2 5/20 0.47
HPGD P15428 4/20 0.47
HSD17B10 Q99714 2/20 0.47
PDE5A O76074 3/20 0.46
MGAM O43451 2/20 0.46
GAA P10253 2/20 0.46
SI P14410 1/20 0.46
MGAM2 Q2M2H8 1/20 0.46
GCGR P47871 1/20 0.41
ALDH1A1 P00352 3/20 0.41
MAPT P10636 2/20 0.41
MEN1 O00255 1/20 0.41
NPC1 O15118 1/20 0.41
GLA P06280 1/20 0.41
POLB P06746 1/20 0.41
IDO1 P14902 1/20 0.41
RECQL P46063 1/20 0.41
TDO2 P48775 1/20 0.41
RAB9A P51151 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31429523 0.85 KDM4E (0.51) KDM4EHPGDHSD17B10PDE5AMGAM
SCHEMBL31429578 0.84 SMPD3 (0.54) SMPD3KDM4EHPGDHSD17B10MGAM
SCHEMBL31429765 0.83 SMPD3 (0.53) SMPD3KDM4EHPGDHSD17B10MGAM
SCHEMBL31429575 0.83 SMPD3 (0.53) SMPD3KDM4EHPGDHSD17B10PDE5A
SCHEMBL31429633 0.82 SMPD3 (0.52) SMPD3KDM4EHPGDHSD17B10GCGR
SCHEMBL31429675 0.82 SMPD3 (0.52) SMPD3KDM4EGCGRMAPTNPC1
SCHEMBL31429574 0.82 SMPD3 (0.52) SMPD3KDM4EHPGDHSD17B10PDE5A
SCHEMBL31429709 0.79 SMPD3 (0.49) SMPD3KDM4EHPGDHSD17B10PDE5A
SCHEMBL6616423 0.79 SMPD3 (0.57) SMPD3KDM4EHSD17B10PDE5AGAA
SCHEMBL6761455 0.75 KDM4E (0.57) SMPD3KDM4EHPGDHSD17B10PDE5A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260109849-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-04-23 US claimed
WO-2025121026-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, RESIN FILM, AND SEMICONDUCTOR DEVICE 旭化成株式会社 2025-06-12 WO claimed
CN-119894957-A Epoxy resin composition, resin paste, film-type adhesive, printed circuit board, semiconductor chip package, and electronic device 旭化成株式会社 2025-04-25 CN claimed
WO-2025058018-A1 COMPOUND 旭化成株式会社 2025-03-20 WO claimed
WO-2025009354-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE 旭化成株式会社 2025-01-09 WO claimed
US-20260109849-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-04-23 US disclosed
WO-2025121026-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, RESIN FILM, AND SEMICONDUCTOR DEVICE 旭化成株式会社 2025-06-12 WO disclosed
CN-119894957-A Epoxy resin composition, resin paste, film-type adhesive, printed circuit board, semiconductor chip package, and electronic device 旭化成株式会社 2025-04-25 CN disclosed
WO-2025058018-A1 COMPOUND 旭化成株式会社 2025-03-20 WO disclosed
WO-2025009354-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE 旭化成株式会社 2025-01-09 WO disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260109849-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE ASH2L, DOT1L, ASH1L SMPD3 4868/4885KDM4E 160/4885HPGD 2036/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.