SCHEMBL31429633

SCHEMBL31429633

CCCCc1nc(-c2ccc(Cl)cc2O)[nH]c1C

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SMPD3 Q9NY59 1/20 0.52
CRHR1 P34998 2/20 0.38
ALDH1A1 P00352 3/20 0.38
MEN1 O00255 2/20 0.38
KMT2A Q03164 2/20 0.38
NPC1 O15118 2/20 0.38
MAPK1 P28482 2/20 0.38
RAB9A P51151 2/20 0.38
SMN1; SMN2 Q16637 2/20 0.38
KDM4E B2RXH2 2/20 0.38
LMNA P02545 1/20 0.38
HSP90AA1 P07900 1/20 0.38
MAPT P10636 1/20 0.38
HPGD P15428 1/20 0.38
CASP3 P42574 1/20 0.38
HTT P42858 1/20 0.38
CDK9 P50750 1/20 0.38
SENP7 Q9BQF6 1/20 0.38
SIRT1 Q96EB6 1/20 0.37
SLC9A1 P19634 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31429578 0.86 SMPD3 (0.54) SMPD3MEN1KMT2ANPC1MAPK1
SCHEMBL31429774 0.86 SLC9A1 (0.39) SMPD3CRHR1ALDH1A1NPC1RAB9A
SCHEMBL31429675 0.84 SMPD3 (0.52) SMPD3NPC1MAPK1RAB9ASMN1; SMN2
SCHEMBL31429574 0.84 SMPD3 (0.52) SMPD3NPC1MAPK1RAB9ASMN1; SMN2
SCHEMBL31429535 0.82 SMPD3 (0.52) SMPD3ALDH1A1MEN1KMT2ANPC1
SCHEMBL31429765 0.80 SMPD3 (0.53) SMPD3ALDH1A1MEN1KMT2ANPC1
SCHEMBL31429758 0.77 SMPD3 (0.43) SMPD3ALDH1A1MEN1KMT2AMAPK1
SCHEMBL31429575 0.75 SMPD3 (0.53) SMPD3ALDH1A1NPC1RAB9ASMN1; SMN2
SCHEMBL31429597 0.72 SLC9A1 (0.39) ALDH1A1MEN1KMT2AMAPK1KDM4E
SCHEMBL31429664 0.72 F2 (0.45) SMPD3ALDH1A1MEN1KMT2ANPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260109849-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-04-23 US disclosed
WO-2025121026-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, RESIN FILM, AND SEMICONDUCTOR DEVICE 旭化成株式会社 2025-06-12 WO disclosed
CN-119894957-A Epoxy resin composition, resin paste, film-type adhesive, printed circuit board, semiconductor chip package, and electronic device 旭化成株式会社 2025-04-25 CN disclosed
WO-2025058018-A1 COMPOUND 旭化成株式会社 2025-03-20 WO disclosed
WO-2025009354-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE 旭化成株式会社 2025-01-09 WO disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260109849-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE ASH2L, DOT1L, ASH1L SMPD3 4868/4885CRHR1 1150/4885ALDH1A1 1223/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.