SCHEMBL31429574

SCHEMBL31429574

CCCCc1nc(-c2ccc(Br)cc2O)[nH]c1C

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SMPD3 Q9NY59 1/20 0.52
NPC1 O15118 3/20 0.48
RAB9A P51151 3/20 0.48
NFKB1 P19838 2/20 0.48
NFKB2 Q00653 2/20 0.48
RELA Q04206 2/20 0.48
SMN1; SMN2 Q16637 2/20 0.48
GAA P10253 2/20 0.48
MAPK1 P28482 2/20 0.35
TP53 P04637 1/20 0.35
POLB P06746 1/20 0.35
KDM4E B2RXH2 2/20 0.35
PKM P14618 1/20 0.35
GFER P55789 1/20 0.34
PTGES O14684 1/20 0.34
HPGD P15428 2/20 0.33
HTT P42858 2/20 0.33
ADORA2A P29274 1/20 0.33
ADORA2B P29275 1/20 0.33
MGAM O43451 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31429578 0.86 SMPD3 (0.54) SMPD3NPC1RAB9ANFKB1NFKB2
SCHEMBL31429665 0.86 GAA (0.37) SMPD3NPC1RAB9ANFKB1NFKB2
SCHEMBL31429675 0.84 SMPD3 (0.52) SMPD3NPC1RAB9ANFKB1NFKB2
SCHEMBL31429633 0.84 SMPD3 (0.52) SMPD3NPC1RAB9ANFKB1NFKB2
SCHEMBL31429535 0.82 SMPD3 (0.52) SMPD3NPC1RAB9ASMN1; SMN2GAA
SCHEMBL31429765 0.80 SMPD3 (0.53) SMPD3NPC1RAB9ANFKB1NFKB2
SCHEMBL31429576 0.77 SMPD3 (0.43) SMPD3NPC1RAB9ANFKB1NFKB2
SCHEMBL31429575 0.75 SMPD3 (0.53) SMPD3NPC1RAB9ASMN1; SMN2GAA
SCHEMBL31429524 0.72 PTGES (0.36) SMPD3RAB9ASMN1; SMN2GAAKDM4E
SCHEMBL31429664 0.72 F2 (0.45) SMPD3NPC1RAB9ANFKB1NFKB2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260109849-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-04-23 US disclosed
WO-2025121026-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, RESIN FILM, AND SEMICONDUCTOR DEVICE 旭化成株式会社 2025-06-12 WO disclosed
CN-119894957-A Epoxy resin composition, resin paste, film-type adhesive, printed circuit board, semiconductor chip package, and electronic device 旭化成株式会社 2025-04-25 CN disclosed
WO-2025058018-A1 COMPOUND 旭化成株式会社 2025-03-20 WO disclosed
WO-2025009354-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE 旭化成株式会社 2025-01-09 WO disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260109849-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE ASH2L, DOT1L, ASH1L SMPD3 4868/4885NPC1 4813/4885RAB9A 4543/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.