SCHEMBL31429655

SCHEMBL31429655

Oc1ccc(F)cc1-c1nc2ccccc2[nH]1

nearest known ligand 0.62

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
F2 P00734 1/20 0.62
F10 P00742 1/20 0.62
PLG P00747 1/20 0.62
PLAU P00749 1/20 0.62
PLAT P00750 1/20 0.62
PRSS1 P07477 1/20 0.62
AMY1A P0DUB6 4/20 0.59
F7 P08709 2/20 0.58
RAB9A P51151 8/20 0.58
NPC1 O15118 7/20 0.58
ALDH1A1 P00352 5/20 0.58
KDM4E B2RXH2 5/20 0.58
SMN1; SMN2 Q16637 4/20 0.58
PKM P14618 2/20 0.58
L3MBTL1 Q9Y468 1/20 0.58
CASP6 P55212 1/20 0.56
NPSR1 Q6W5P4 3/20 0.53
HSD17B10 Q99714 2/20 0.53
ABCB11 O95342 1/20 0.53
TP53 P04637 1/20 0.53

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31429744 0.89 AMY1A (0.67) F2F10PLGPLAUPLAT
SCHEMBL2784089 0.85 RAB9A (0.67) AMY1AF7RAB9ANPC1ALDH1A1
SCHEMBL31429678 0.84 GUSB (0.65) AMY1AF7RAB9ANPC1ALDH1A1
SCHEMBL31429538 0.82 AMY1A (0.64) F2F10PLGPLAUPLAT
SCHEMBL31429747 0.82 F2 (0.62) F2F10PLGPLAUPLAT
SCHEMBL29946404 0.82 ADORA2A (0.65) F2F10PLGPLAUPLAT
SCHEMBL16142437 0.82 F2 (0.62) F2F10PLGPLAUPLAT
SCHEMBL31429745 0.82 F2 (0.62) F2F10PLGPLAUPLAT
SCHEMBL7396100 0.82 AMY1A (0.64) F2F10PLGPLAUPLAT
SCHEMBL28456599 0.82 F2 (0.62) F2F10PLGPLAUPLAT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260109849-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-04-23 US disclosed
WO-2025121026-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, RESIN FILM, AND SEMICONDUCTOR DEVICE 旭化成株式会社 2025-06-12 WO disclosed
WO-2025100081-A1 COMPOSITION, EPOXY RESIN COMPOSITION, FILM, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE 旭化成株式会社 2025-05-15 WO disclosed
CN-119894957-A Epoxy resin composition, resin paste, film-type adhesive, printed circuit board, semiconductor chip package, and electronic device 旭化成株式会社 2025-04-25 CN disclosed
WO-2025058018-A1 COMPOUND 旭化成株式会社 2025-03-20 WO disclosed
WO-2025009354-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE 旭化成株式会社 2025-01-09 WO disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260109849-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE ASH2L, DOT1L, ASH1L F2 3877/4885F10 2016/4885PLG 3950/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.