SCHEMBL3148715

SCHEMBL3148715

NC1(N)c2ccccc2CC1c1ccccc1

nearest known ligand 0.47

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
KDM1A O60341 16/20 0.47
MAOA P21397 16/20 0.47
MAOB P27338 16/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
4,4'-Methylenedianiline SCHEMBL10594204 0.85 HTR6 (0.41) KDM1AMAOAMAOB
SCHEMBL3947348 0.77 KDM1A (0.47) KDM1AMAOAMAOB
SCHEMBL4541268 0.77 KDM1A (0.38) KDM1AMAOAMAOB
SCHEMBL7782470 0.76 KDM1A (0.43) KDM1AMAOAMAOB
SCHEMBL161565 0.73 MAPK1 (0.40) KDM1AMAOAMAOB
SCHEMBL30376825 0.73 MAPK1 (0.40) KDM1AMAOAMAOB
SCHEMBL28180549 0.73 KDM1A (0.39) KDM1AMAOAMAOB
SCHEMBL2390674 0.73 KDM1A (0.41) KDM1AMAOAMAOB
Hydrochloric Acid SCHEMBL8966532 0.72 MAPK1 (0.39) KDM1AMAOAMAOB
SCHEMBL9405304 0.72 MAPK1 (0.39) KDM1AMAOAMAOB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 79 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3325533-B1 CURABLE BENZOXAZINE COMPOSITIONS HUNTSMAN ADVANCED MAT AMERICAS LLC (US) 2023-09-13 EP claimed
CN-115867589-A Thermosetting resin composition 亨斯迈先进材料美国有限责任公司 2023-03-28 CN claimed
CN-107995916-B Curable benzoxazine compositions 亨斯迈先进材料美国有限责任公司 2021-08-10 CN claimed
CN-110582487-A Curable resin system 亨斯迈先进材料美国有限责任公司 2019-12-17 CN claimed
EP-0626412-B1 Polyimide oligomers CIBA GEIGY AG (CH) 1997-09-17 EP claimed
EP-0572005-B1 Slipping layer of polyimide-siloxane for dye-donor element used in thermal dye transfer EASTMAN KODAK CO (US) 1995-04-05 EP claimed
EP-0379468-B1 Curable epoxy resin composition containing a thermoplastic resin having phenolic end groups CIBA GEIGY AG (CH) 1995-03-01 EP claimed
EP-0199999-B2 Wear resistant poly(aryl ether ketone)/polyimide blends AMOCO CORP (US) 1994-12-07 EP claimed
US-5006611-A Prepreg for fiber reinforced composite; adhesive films CIBA-GEIGY CORPORATION (US) 1991-04-09 US claimed
EP-0379468-A2 Curable epoxy resin composition containing a thermoplastic resin having phenolic end groups CIBA-GEIGY AG (CH) 1990-07-25 EP claimed
JP-6329794-A None JP disclosed
US-20240329525-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-10-03 US disclosed
US-20240210827-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-06-27 US disclosed
CN-113820920-B Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2023-07-04 CN disclosed
CN-110582487-B Curable resin system 亨斯迈先进材料美国有限责任公司 2023-06-30 CN disclosed
EP-0008644-B1 STORAGE-STABLE, THERMOSETTING MIXTURES BASED ON POLYIMIDES AND POLY-BETA-IMINOCROTONIC ACID NITRILES, AND THEIR USE CIBA-GEIGY AG (CH) 1982-04-21 EP disclosed
US-4291146-A Heat-curable mixtures, which are stable on storage, of expoxide resins and β-aminocrotonic acid derivatives CIBA-GEIGY CORPORATION (US) 1981-09-22 US disclosed
US-4247672-A STORAGE STABILITY, MOLDING MATERIALS CIBA-GEIGY CORPORATION (US) 1981-01-27 US disclosed
EP-0012715-A1 Epoxide resin/beta-aminocrotonic acid derivative compositions which are heat curable and stable when stored, and the manufacture of insoluble and unmeltable plastic products therefrom CIBA-GEIGY AG (CH) 1980-06-25 EP disclosed
EP-0008644-A1 Storage-stable, thermosetting mixtures based on polyimides and poly-beta-iminocrotonic acid nitriles, and their use CIBA-GEIGY AG (CH) 1980-03-19 EP disclosed