Predicted protein targets (top 17)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | DHODH | Q02127 | 6/20 | 0.57 |
| ▸ | MCL1 | Q07820 | 1/20 | 0.56 |
| ▸ | MAOA | P21397 | 1/20 | 0.55 |
| ▸ | KMO | O15229 | 2/20 | 0.53 |
| ▸ | PBRM1 | Q86U86 | 1/20 | 0.52 |
| ▸ | RXRA | P19793 | 2/20 | 0.51 |
| ▸ | RXRB | P28702 | 2/20 | 0.51 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.47 |
| ▸ | MEN1 | O00255 | 2/20 | 0.47 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.47 |
| ▸ | LMNA | P02545 | 2/20 | 0.47 |
| ▸ | MAPT | P10636 | 2/20 | 0.47 |
| ▸ | HPGD | P15428 | 2/20 | 0.47 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.47 |
| ▸ | HDAC1 | Q13547 | 1/20 | 0.46 |
| ▸ | PRKDC | P78527 | 1/20 | 0.45 |
| ▸ | GLA | P06280 | 1/20 | 0.44 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL20612659 | 0.93 | KMO (0.63) | DHODHKMORXRARXRBLMNA | |
| SCHEMBL1252434 | 0.89 | KMO (0.68) | DHODHMCL1MAOAKMOPBRM1 | |
| SCHEMBL2726729 | 0.89 | DHODH (0.65) | DHODHMAOAKMOPBRM1RXRA | |
| SCHEMBL2558630 | 0.86 | KMO (0.51) | DHODHKMORXRARXRBLMNA | |
| SCHEMBL13525285 | 0.86 | DHODH (0.70) | DHODHKMORXRARXRB | |
| SCHEMBL1142393 | 0.86 | KDM4E (0.50) | DHODHKMORXRARXRBKDM4E | |
| SCHEMBL3791008 | 0.85 | DHODH (0.57) | DHODHMCL1MAOAPBRM1KDM4E | |
| SCHEMBL2559724 | 0.84 | TRIM24 (0.65) | DHODHMCL1KMORXRARXRB | |
| SCHEMBL3793183 | 0.84 | MAOA (0.48) | MCL1MAOAPBRM1KDM4EMEN1 | |
| SCHEMBL1750548 | 0.83 | MAOA (0.63) | DHODHMCL1MAOAKMORXRA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119463417-A | High-heat-conductivity epoxy resin composite material and preparation method thereof | 安徽邦德锐新材料科技有限公司 | 2025-02-18 | — | — | CN | claimed |
| CN-119463417-A | High-heat-conductivity epoxy resin composite material and preparation method thereof | 安徽邦德锐新材料科技有限公司 | 2025-02-18 | — | — | CN | disclosed |