SCHEMBL3149738

SCHEMBL3149738

COC(=O)COCCN

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12092171 0.96 TSHR (0.39)
SCHEMBL16543622 0.96 TSHR (0.39)
SCHEMBL18912481 0.96 TSHR (0.39)
SCHEMBL9526687 0.96 TSHR (0.39)
Hydrochloric Acid SCHEMBL19617019 0.94 LMNA (0.41)
SCHEMBL21491423 0.86 TSHR (0.41)
SCHEMBL6463788 0.85 TSHR (0.50)
SCHEMBL28626375 0.85 CES2 (0.39)
Hydrochloric Acid SCHEMBL342951 0.85 KDM4E (0.41)
SCHEMBL28630314 0.84 TSHR (0.40)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-109651286-B High-selectivity synthesis method of 4- (4-aminophenyl) morpholine-3-one 新发药业有限公司 2020-08-11 CN claimed
CN-109651286-A A kind of highly selective 4-(4- aminophenyl) morpholine -3- ketone synthetic method 新发药业有限公司 2019-04-19 CN claimed
CN-115044040-B Polyimide-containing polymer, positive photosensitive resin composition, negative photosensitive resin composition, and pattern forming method 信越化学工业株式会社 2024-07-02 CN disclosed
CN-113527101-B Novel compound, polymer, process for producing the same, photosensitive resin composition, pattern forming process, cured film, and electronic component 信越化学工业株式会社 2024-04-23 CN disclosed
CN-111381447-B Photosensitive resin composition, laminate, and pattern forming method 信越化学工业株式会社 2024-03-08 CN disclosed
CN-117501180-A Laminate, method for producing laminate, and method for forming pattern 信越化学工业株式会社 2024-02-02 CN disclosed
CN-109388023-B Photosensitive resin composition, photosensitive resin coating, photosensitive dry film, laminate, and pattern forming method 信越化学工业株式会社 2023-12-22 CN disclosed
CN-109388022-B Silicone-structure-containing polymer, photosensitive resin composition, photosensitive resin coating layer, photosensitive dry film, laminate, and pattern forming method 信越化学工业株式会社 2023-07-28 CN disclosed
CN-113527680-B Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2023-04-28 CN disclosed
CN-108107676-B Chemically amplified positive resist film laminate and pattern formation method 信越化学工业株式会社 2023-02-21 CN disclosed
CN-108388082-B Photosensitive resin composition, photosensitive dry film, photosensitive resin coating and pattern forming method 信越化学工业株式会社(JP) 2023-01-13 CN disclosed
CN-110727174-A Photosensitive resin composition, photosensitive resin coating, photosensitive dry film and black matrix 信越化学工业株式会社 2020-01-24 CN disclosed
CN-105315467-B Polymer having organosilicon structure, negative resist composition, photocurable dry film, and patterning method 信越化学工业株式会社 2019-12-20 CN disclosed
CN-109651286-A A kind of highly selective 4-(4- aminophenyl) morpholine -3- ketone synthetic method 新发药业有限公司 2019-04-19 CN disclosed
US-8283358-B2 N-sulfonamido polycyclic pyrazolyl compounds ELAN PHARMACEUTICALS, INC. (US) 2012-10-09 US disclosed
US-20100081680-A1 N-SULFONAMIDO POLYCYCLIC PYRAZOLYL COMPOUNDS ELAN PHARMACEUTICALS, INC. 2010-04-01 US disclosed
EP-1693707-A1 Positive resist composition, and patterning process using the same Shinetsu Chemical Co., Ltd. (JP) 2006-08-23 EP disclosed
US-20060147836-A1 Resist composition and patterning process using the same SHIN-ETSU CHEMICAL CO., LTD. (JP) 2006-07-06 US disclosed
US-20050079446-A1 Novel polymerizable compound, polymer, positive-resist composition, and patterning process using the same SHIN-ETSU CHEMICAL CO., LTD. (JP) 2005-04-14 US disclosed
US-20050079440-A1 Novel polymer, positive resist composition, and patterning process using the same SHIN-ETSU CHEMICAL CO., LTD. (JP) 2005-04-14 US disclosed